Inductor Attached to Power Device Package via Adhesion Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor packaging, existing technologies face challenges in efficiently mounting inductors and power devices on printed circuit boards (PCBs) due to misalignment and poor thermal conduction, leading to improper solder connections and heat dissipation issues.
Innovation Solution
A device configuration where an inductor is attached to a package with an adhesion layer, and the inductor's leads are configured to be substantially co-planar with the package's surface, allowing for easy mounting and efficient heat dissipation, with the adhesion layer conducting electricity and providing structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional mounting methods are used for inductors and power devices, then the components can be attached to the PCB, but misalignment occurs leading to improper solder connections
Solution Approach 1:
The patent combines the inductor and power device into a single integrated package structure where the inductor is mounted directly on the power device package. This merging eliminates the separate mounting operations that cause misalignment, ensuring precise alignment between components and their corresponding PCB solder pads, thereby improving both manufacturing precision and solder connection reliability.
Solution Approach 2:
The patent transitions from a planar mounting arrangement to a three-dimensional stacked configuration where the inductor is positioned vertically above the power device package. This dimensional change allows the components to be mounted in layers, reducing the PCB footprint while maintaining precise alignment through the vertical stacking architecture.
2Area of stationary object
If traditional packaging structures are used, then components can be mounted, but the footprint on the PCB is large
Solution Approach 1:
The patent employs vertical stacking to arrange the inductor and power device in the Z-dimension rather than spreading them out in the X-Y plane. This three-dimensional packaging approach significantly reduces the PCB footprint by utilizing the vertical space above the package, while the integrated structure manages the complexity through standardized interconnection interfaces.
Solution Approach 2:
The inductor is positioned within the vertical space above the power device package, creating a nested arrangement where components are housed within the overall package envelope. This nesting approach minimizes the external dimensions and footprint while containing all necessary components within a compact integrated structure.
3Temperature
If conventional mounting approaches are used, then components can be attached, but heat dissipation is poor
Solution Approach 1:
The patent merges the thermal management function with the structural mounting function by directly attaching the inductor to the power device package using an adhesion layer that also serves as a thermal conduction path. This integrated approach creates efficient thermal coupling between components without requiring separate heat sinking structures, improving heat dissipation while managing structural complexity.
Solution Approach 2:
The adhesion layer serves as a dual-function intermediary between the inductor and power device package, providing both mechanical bonding and thermal conduction. This intermediary layer facilitates efficient heat transfer from the inductor to the power device package and subsequently to the PCB, enhancing thermal management through a multi-functional component.
4Reliability
If separate mounting of inductor and power device is used, then components can be attached independently, but thermal conduction is poor
Solution Approach 1:
The patent combines the mounting process into a single integrated operation where the inductor is attached directly to the power device package in one step. This merged approach establishes optimal thermal conduction pathways through direct contact and the adhesion layer, eliminating the need for separate mounting operations that would compromise thermal coupling, thereby improving thermal conduction efficiency while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables reliable electrical connections, reduces the footprint on the PCB, and enhances heat dissipation, improving the performance and reliability of semiconductor packages by ensuring proper soldering and thermal management.
Implementation Method 1
The adhesion layer is configured to conduct electricity between the package and the inductor
Implementation Method 2
enhances heat dissipation, improving the performance and reliability of semiconductor packages by ensuring proper soldering and thermal management
Data Source
AI summary
In some examples, a device comprises an inductor and a package comprising at least one power device. The package is attached to the inductor by an adhesion layer, and the inductor comprises one or more leads. A first lead of the one or more leads is configured to conduct electricity between the at least one power device and the inductor, and a surface of the first lead and a surface of the package are substantially co-planar.