Inductor Component Single-Layer Resin Embedding
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Solution Overview
Problem
Inductor components with inductor electrodes within insulating layers face increased resistance and reliability issues due to lamination skew, leading to variations in resistance values and heat emission when current is applied, which affects their performance and reliability.
Innovation Solution
The method involves manufacturing inductor components by first completing the inductor electrode and then embedding it in a single-layer resin structure, eliminating lamination skew and reducing connection resistance through ultrasonic bonding, thereby maintaining consistent characteristics and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If column-shaped conductors are formed as via conductors or through-hole conductors in each magnetic layer and stacked in an overlapping manner, then the inductor electrode can be formed within the multilayer substrate, but lamination skew results in smaller connected surface area between adjacent conductors, increasing resistance value and causing variation in resistance value
Solution Approach 1:
The patent divides the formation process into separate stages: first forming the inductor electrode structure on a support plate, then separately forming the resin layer with via holes, and finally assembling them. This segmentation eliminates the lamination skew problem that occurs when trying to align conductors across multiple magnetic layers simultaneously.
Solution Approach 2:
The support plate serves as an intermediary substrate that holds the inductor electrode structure during manufacturing. This intermediary allows precise positioning of column-shaped conductors before final assembly, eliminating positioning errors that would occur during direct lamination of multiple layers.
2Ease of manufacture
If column-shaped conductors are formed by stacking via conductors or through-hole conductors, then the inductor electrode structure can be created, but the connected surface area between adjacent conductors decreases, increasing overall resistance value of the inductor electrode
Solution Approach 1:
The inductor electrode structure including column-shaped conductors is preliminarily formed on the support plate before final assembly. This preliminary formation allows optimization of conductor geometry and positioning to maximize connected surface area, which would be difficult to achieve if conductors were formed by stacking pre-made via or through-hole conductors.
3Ease of manufacture
If multiple resin layers are laminated to embed the inductor electrode, then the inductor component structure can be completed, but lamination skew causes variation in resistance value and characteristics of the inductor electrode
Solution Approach 1:
The patent merges the resin layer formation with the via hole creation process by forming both features simultaneously in a single resin layer. This eliminates the need for multiple lamination steps that would cause skew and variation in inductor electrode characteristics.
Solution Approach 2:
Instead of forming via holes after lamination of multiple resin layers, the patent inverts the process by creating a single resin layer with integrated via holes that accommodate the column-shaped conductors. This inversion eliminates lamination skew entirely.
4Ease of manufacture
If lamination skew occurs among magnetic layers, then assembly can proceed, but heat emission increases at connection locations when current is applied, reducing reliability of the inductor electrode
Solution Approach 1:
The patent converts the potential harm of lamination skew into a benefit by designing a manufacturing process that eliminates skew entirely. The support plate-based assembly method ensures precise alignment of column-shaped conductors with via holes, maximizing connected surface area and minimizing heat emission at connection points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces variations in resistance values and heat emission, enhancing the reliability and performance of inductor components by eliminating the issues associated with lamination skew and multiple resin layer formation.
Implementation Method 1
a resin layer forming step of laminating a resin layer onto the one main surface of the support plate such that the inductor electrode is embedded within the resin layer
Implementation Method 2
reducing connection resistance through ultrasonic bonding
Data Source
AI summary
An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.