Inductor at Second Level Interface Using External Magnetic Materials
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Solution Overview
Problem
Inductors in electronic circuit packages face challenges in miniaturization, as better characteristics often require increased size, and magnetic materials used in coreless substrates can corrode and leach during processing, affecting bath life and performance.
Innovation Solution
The formation of an inductor at a second level interface using substrates with traces that form coil loops, where magnetic materials are applied externally to avoid exposure to chemical processing, allowing for increased z-axis form factor without adding size, using techniques like sputtering and chemical vapor deposition to apply insulating magnetic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic materials are embedded in coreless substrates during processing, then inductor performance is improved, but magnetic materials corrode and leach during chemical processing, reducing bath life and increasing costs
Solution Approach 1:
The patent extracts the magnetic material from the chemical processing environment by applying it externally to the substrate after processing is complete, rather than embedding it during processing. This separation prevents the magnetic material from being exposed to corrosive chemical baths, eliminating corrosion and leaching issues while maintaining inductor performance.
Solution Approach 2:
The patent performs all chemical processing of the substrate and traces before applying the magnetic material. By completing the substrate preparation in advance and then adding the magnetic material as a separate final step, the magnetic material is protected from exposure to chemical processing baths, preventing degradation while ensuring the substrate is ready to support the inductor structure.
2Power
If inductor size is increased to improve power delivery characteristics, then inductor performance is improved, but z-height of the electronic device increases
Solution Approach 1:
The patent transitions from increasing inductor size in the planar dimensions to utilizing the vertical dimension by applying magnetic materials externally on the surface of the substrate. This allows the inductor to achieve improved power delivery characteristics through enhanced magnetic field properties rather than through increased physical size, thereby maintaining a compact z-height.
Solution Approach 2:
The patent employs composite structures by applying magnetic materials as external layers on the substrate, creating a multi-layer composite inductor. This composite approach enables improved power delivery through the magnetic material properties without requiring an increase in the overall inductor footprint or z-height, as the magnetic enhancement is achieved through material composition rather than dimensional expansion.
3Ease of manufacture
If magnetic materials are applied externally to avoid corrosion, then processing costs are reduced, but inductor characteristics may be compromised
Solution Approach 1:
The patent extracts the magnetic material application step from the chemical processing sequence and positions it as a separate post-processing operation. This extraction eliminates the corrosion and leaching problems that would otherwise compromise inductor characteristics, while the controlled external application ensures optimal magnetic material placement and performance.
Solution Approach 2:
The patent completes all substrate preparation and trace formation before applying the magnetic material. This preliminary completion of substrate processing ensures that the substrate is fully prepared to support the inductor structure, and the subsequent magnetic material application can be optimized for performance without interference from chemical processing, thereby maintaining or enhancing inductor characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved power delivery without increasing the z-height of electronic devices, maintaining performance while preventing magnetic material corrosion and extending bath life, thus reducing processing costs.
Implementation Method 1
using techniques like sputtering and chemical vapor deposition to apply insulating magnetic materials
Implementation Method 2
using techniques like sputtering and chemical vapor deposition to apply insulating magnetic materials
Data Source
AI summary
Techniques are provided for an inductor at a second level interface between a first substrate and a second substrate. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first substrate, second conductive traces of a second non-semiconductor substrate, and a plurality of connectors configured to connect the first substrate with the second substrate. Each connector of the plurality of connectors can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.