Inductor Wiring Structure With Selective Insulation for Higher Inductance
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Solution Overview
Problem
Existing inductor components face a trade-off between maximizing magnetic layer proportion for improved inductance and maintaining adequate insulation properties, as reducing or omitting insulation layers compromises electrical insulation.
Innovation Solution
An inductor component design with a magnetic layer directly contacting the inductor wiring line on one side and an insulation layer on the other, while maintaining insulation properties through strategic interposition of insulation layers at critical points, allowing for increased magnetic layer proportion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the proportion of the insulation substrate or the insulation layer is reduced to increase the magnetic layer proportion, then the inductance is improved, but the insulation property cannot be ensured
Solution Approach 1:
The patent applies local quality by making the insulation layer non-uniform: it is present at certain locations (where wiring lines are disposed) and absent at other locations (where magnetic layers contact directly). This allows the magnetic layer proportion to be increased in areas where insulation is not needed, while maintaining insulation properties where wiring lines are present, thus resolving the contradiction between maximizing magnetic layer proportion and ensuring insulation property.
2Quantity of substance
If the insulation layer is completely omitted to maximize magnetic layer proportion, then the inductance is maximized, but the insulation property is compromised
Solution Approach 1:
The patent extracts the insulation layer from being a continuous, uniform component and removes it selectively from areas where it is not needed for insulation. By taking out the insulation layer only from regions where direct magnetic layer contact is acceptable, the design maximizes the magnetic layer proportion while retaining insulation functionality in critical areas, thus resolving the contradiction.
3Quantity of substance
If the insulation layer is made thinner to increase magnetic layer proportion, then the inductance is improved, but the insulation effectiveness is reduced
Solution Approach 1:
Rather than uniformly thinning the insulation layer, the patent applies local quality by completely removing the insulation layer only where magnetic layers are disposed, while maintaining the insulation layer at its full thickness in areas where wiring lines require insulation. This approach maximizes magnetic layer proportion in non-critical areas while preserving insulation effectiveness in critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances inductance by increasing the magnetic layer proportion while ensuring effective insulation, reducing DC resistance, and maintaining structural integrity without additional substrates.
Implementation Method 1
a first magnetic layer; an inductor wiring line laminated on a main face of the first magnetic layer
Implementation Method 2
the proportion of the magnetic layer may be made larger as the proportion of the insulation substrate or the insulation layer is smaller when the overall volume of the inductor component is the same. This is advantageous in terms of improving the inductance
Data Source
AI summary
The inductor component includes a first magnetic layer, an inductor wiring line laminated on a main face of the first magnetic layer, a second magnetic layer disposed in the same layer as the inductor wiring line, a third magnetic layer disposed on a main face of the inductor wiring line and the second magnetic layer on a side opposite to the first magnetic layer, and an insulation layer being a non-magnetic material in contact with part of a surface of the inductor wiring line. The entire face of the surface of the inductor wiring line on the first magnetic layer side is in contact with the first magnetic layer, and a face of the surface of the inductor wiring line on the second magnetic layer side is in contact with the insulation layer.