Spring-Loaded Inductor Temperature Sensor for Hotspot Cooling
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Solution Overview
Problem
Conventional inductor designs for hybrid electric vehicles face low cooling efficiency due to a long thermal path and low thermal conductivity of potting materials, which limits the effective placement and fixation of temperature sensors for accurate thermal management.
Innovation Solution
A temperature sensor arrangement with a spring-biased cover and thermal pad, allowing for improved thermal communication and secure fixation within a gap between windings, eliminating the need for potting material and enhancing heat dissipation by direct oil cooling, while maintaining sensor accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If potting material is applied to fix the temperature sensor, then the sensor is well fixed and protected, but the thermal conductivity is low and cooling efficiency is reduced
Solution Approach 1:
The patent removes the potting material from the system entirely. Instead of using epoxy resin to fix the sensor, the design uses a spring mechanism that mechanically secures the sensor in place without any thermal interface material, thereby eliminating the thermal resistance barrier and enabling direct thermal contact between the sensor and the inductor core.
Solution Approach 2:
The patent divides the sensor assembly into separate functional components: a spring mechanism for mechanical fixation, a thermal pad for thermal contact, and the sensor element itself. This segmentation allows each component to perform its specific function optimally - the spring provides secure mechanical fixation while the thermal pad ensures excellent thermal conductivity to the inductor core.
2Ease of manufacture
If the thermal path is made long to accommodate assembly sequence, then all parts can be assembled together first, but the cooling efficiency is reduced
Solution Approach 1:
The patent incorporates the thermal pad and spring mechanism into the sensor assembly before insertion into the inductor. This preliminary preparation allows the sensor sub-assembly to be pre-configured with optimal thermal and mechanical properties, then quickly installed into the final position without requiring long thermal paths or complex post-assembly thermal management.
3Ease of operation
If the sensor is positioned far from the hotspot, then the sensor is easier to install, but the temperature monitoring accuracy is reduced
Solution Approach 1:
The patent uses a thermal pad as an intermediary element that bridges the gap between the sensor and the inductor core hotspot. This thermal pad maintains optimal thermal contact and ensures accurate heat transfer from the highest temperature region to the sensor, allowing the sensor to be positioned at the optimal location for both accuracy and accessibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation and ensures accurate temperature monitoring by maintaining sensor proximity to the inductor hotspot, improving thermal management and reducing thermal resistance.
Implementation Method 1
a first spring member disposed between the cover and the recessed second surface such that the first spring member applies a force to separate the cover and housing
Implementation Method 2
a contact pad disposed within a cavity defined by the recessed first surface and defining a thermally conductive surface that thermally communicates with the first set of windings
Data Source
AI summary
A temperature sensor arrangement includes a housing having on opposite sides thereof a spring element and cover, and a temperature sensor lead and thermal pad such that the spring element is disposed between one of the sides and the cover, the temperature sensor lead is disposed between the other of the sides and the thermal pad, and the cover and thermal pad define opposite exterior sides of the temperature sensor arrangement. The housing carries and permits relative movement of the cover. The spring pushes the cover away from the one of the sides.