Inductor Element Shield Wires Reduce Noise Interference

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Solution Overview

Problem

Conventional inductor elements with spiral coil patterns suffer from noise interference due to capacitive coupling with peripheral wires, which degrades the quality of inductive coupling communication, especially when the coils are large and the communication distance is long, leading to increased bit error rates.

Innovation Solution

The inductor element is designed with coil elements in adjacent layers connected in different directions to form a single coil, incorporating shield wires, wire prohibiting regions, extended coil elements, and a fixed potential at the coil center to minimize noise interference, and arranging coils with point symmetry to reduce differential noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If large coils are used for long-distance inductive coupling communication, then communication distance is improved, but noise interference from capacitive coupling with peripheral wires increases

Engineering Contradiction:
Improvecommunication distanceVSAvoidnoise interference
Core Design Contradiction:
Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

A shield wire is introduced as an intermediary element positioned between the coil and peripheral wires. This shield wire acts as a mediator that blocks or reduces the capacitive coupling between the coil and peripheral wires, thereby reducing noise interference while allowing the coil to maintain its large size for long-distance communication

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful capacitive coupling effect is extracted and isolated by introducing the shield wire. The shield wire specifically targets and addresses the noise pathway between the coil and peripheral wires, separating the communication function from the noise interference

Inventive Principle:
Principle #2Taking out (Extraction)

2Object-affected harmful factors

If shield wires are added to reduce noise, then noise interference is reduced, but device complexity increases

Engineering Contradiction:
Improvenoise interferenceVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shield wire is constructed using the same material and fabrication process as the existing coil and peripheral wires. This homogeneity allows the shield wire to be integrated into the existing multi-layer wire structure without requiring new materials or complex additional processing steps

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The shield wire functionality is merged with the existing wire layer structure. Rather than adding a completely separate shielding mechanism, the shield wire is incorporated as another wire layer that works within the existing multi-layer architecture, combining noise reduction with the existing structural framework

Inventive Principle:
Principle #5Merging (Combining)

3Object-affected harmful factors

If wire prohibiting regions are created around coils, then noise interference is reduced, but area utilization decreases

Engineering Contradiction:
Improvenoise interferenceVSAvoidarea utilization
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

Instead of creating large wire prohibiting regions, a thin shield wire is positioned between the coil and peripheral wires. This intermediary approach provides noise reduction with minimal area penalty, as the shield wire occupies only the space immediately adjacent to the coil rather than creating extensive prohibited zones

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the efficiency of wire material usage, reduces noise interference, and maintains high-quality inductive coupling communication over long distances, even when peripheral wires cross the coil, thereby increasing integration density and signal-to-noise ratio.

Implementation Method 1

communication using a magnetic field due to inductive coupling between the LSI (integrated circuit device) chips layered on top of each other and mounted on a substrate via coils formed of wires on the chips

Methodology Applied
Scientific EffectInductive coupling: Electromagnetic Induction

Implementation Method 2

reducing noise caused by capacitive coupling between the inductor element and the peripheral wires

Methodology Applied
Scientific EffectCapacitive coupling: Capacitance

Data Source

PatentUS8872609B2Inductor element and integrated circuit device
Publication Date: 2014.10.28 THRUCHIP JAPAN INC
  • US8872609B2 patent drawing
  • US8872609B2 patent drawing
  • US8872609B2 patent drawing

AI summary

The invention relates to an inductor element and an integrated circuit device where the efficiency of use of wire materials is high and noise interference through capacitive/inductive coupling from peripheral wires is low.Coil elements 1, 2 are provided in at least two adjacent layer levels having main wires which run in different directions so that each coil element 1 (2) is connected to a coil element 2 (1) in a different layer level so as to form one coil, and shield wires 3, 4 are connected to a power 5 either above or below or to the left or right of said coil elements 1, 2.