Electronic Package Structure with Inductor Side Wings
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic package structures are bulky and require additional molds for assembly, leading to increased production costs and limited design flexibility.
Innovation Solution
The method involves forming a substrate with protruding side-wings that assemble with an inductor module to create a space, where package glue is injected to form a package layer, eliminating the need for additional molds and allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic package structures are used with separate molds for assembly, then assembly process is standardized, but volume of the electronic package structure increases and production cost increases
Solution Approach 1:
The patent merges the substrate and inductor module into a single integrated structure where the substrate includes built-in side wings that directly connect to the inductor module. This eliminates the need for separate molds and intermediate assembly steps, thereby reducing the overall volume while maintaining standardized manufacturing processes.
Solution Approach 2:
The patent introduces side wings extending from the substrate in a lateral dimension, creating a three-dimensional integrated structure. This dimensional extension allows the substrate and inductor module to be combined without increasing the footprint area, thus reducing volume while keeping the assembly process manageable.
2Ease of manufacture
If additional molds are used for assembling substrate and inductor module, then assembly is simplified, but production cost increases
Solution Approach 1:
The substrate and inductor module are merged into a single integrated component with side wings that facilitate direct connection. This eliminates the need for additional molds and intermediate assembly tools, reducing production costs while maintaining ease of manufacture through standardized single-mold processing.
3Volume of moving object
If compact design is implemented without additional molds, then volume is reduced, but assembly precision requirements increase
Solution Approach 1:
The side wings are pre-formed as integral parts of the substrate during substrate manufacturing. This preliminary action ensures that the connection interfaces are already prepared with precise dimensions and positions, eliminating the need for high-precision assembly operations and reducing volume through integrated design.
Solution Approach 2:
The integrated structure is segmented into functional zones: the substrate body, the side wings, and the inductor module connection area. This segmentation allows each zone to be optimized independently for its function while maintaining precise relative positioning, thus achieving compact design without excessive precision requirements.
Data Source
AI summary
An inductive component is disclosed. The inductive component comprises a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating electronic devices.