Multilayer Inductor Stack Shielding for Coupling Control
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Solution Overview
Problem
The integration of a shield conductor with a columnar conductor in multilayered electronic components leads to excessive coupling, compromising the desired characteristics due to reduced size and increased electromagnetic interference.
Innovation Solution
A multilayered electronic component design that integrates a shield conductor into the stack, featuring columnar conductors and an inductor conductor layer, with specific arrangements of columnar conductors and ground conductors to mitigate excessive coupling and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the stack size is reduced to achieve miniaturization, then the footprint of the electronic component is reduced, but the coupling between columnar conductors and shield becomes too strong
Solution Approach 1:
A ground conductor layer is introduced as an intermediary between the columnar conductors and the shield conductor. This ground layer acts as a mediator that provides a reference potential and reduces the direct coupling effect between the signal-carrying columnar conductors and the shield, thereby maintaining reliable electrical characteristics even when the stack size is reduced for miniaturization.
Solution Approach 2:
The shielding structure is segmented by dividing it into a shield conductor and a separate ground conductor layer. This segmentation allows the shield to maintain its electromagnetic shielding function while the ground layer independently manages the reference potential and coupling control, preventing excessive coupling when the overall stack size is reduced.
2Productivity
If space between electronic components is reduced to achieve densification, then mounting density is improved, but electromagnetic interference between components increases
Solution Approach 1:
The ground conductor layer serves as an intermediary that provides a controlled reference potential between adjacent electronic components. By introducing this intermediate reference layer, electromagnetic interference between densely mounted components is reduced as the ground layer shields and references the electrical potential, enabling higher mounting density without excessive interference.
3Object-affected harmful factors
If a shield conductor is provided to suppress electromagnetic interference, then interference suppression is improved, but coupling between columnar conductors and shield becomes excessive
Solution Approach 1:
The ground conductor layer is positioned between the columnar conductors and the shield conductor, acting as an intermediary that prevents direct coupling. This intermediate layer maintains the electromagnetic interference shielding function of the shield while simultaneously reducing the harmful coupling effect by providing a reference potential that decouples the signal paths.
Solution Approach 2:
Different regions of the conductor structure are assigned different functions: the shield conductor provides electromagnetic shielding in the external field region, while the ground conductor layer provides reference potential and coupling control in the internal circuit region. This local differentiation of quality allows simultaneous achievement of interference suppression and coupling control.
Data Source
AI summary
An electronic component includes a stack, a shield conductor integrated into the stack, at least one first columnar conductor, at least one second columnar conductor, an inductor including an inductor conductor layer connecting the at least one first columnar conductor and the at least one second columnar conductor, and at least one third columnar conductor connected to the ground. The shield conductor includes a first conductor part provided to a first side surface of the stack and a second conductor part provided to a second side surface of the stack. The at least one third columnar conductor is arranged between the inductor and the first conductor part.