Built-In Inductor Wiring Substrate With 3D Magnetic Layer Layout
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Solution Overview
Problem
Existing methods for integrating inductors into wiring substrates, such as using magnetic sheets or storing magnetic materials within insulating substrates, fail to achieve desired insulating properties and inductance characteristics due to the lack of magnetic material outside the inductor coil.
Innovation Solution
A wiring substrate design featuring a magnetic material layer with through holes that penetrate both the substrate surfaces, allowing magnetic material to be present both inside and outside the inductor coil, combined with a through hole conductor connecting conductor patterns on either side of the magnetic material layer, enhancing insulating properties and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If magnetic material is stored only inside the inductor coil, then the inductor structure is compact, but the inductance characteristics are insufficient
Solution Approach 1:
The patent extends the magnetic material distribution from a two-dimensional plane to a three-dimensional structure by forming through-holes that penetrate the substrate thickness direction. This allows magnetic material to be present both inside the coil winding and in the regions above and below the substrate, effectively utilizing the third dimension to enhance inductance without increasing planar area.
Solution Approach 2:
The patent creates a nested structure where the inductor coil is wound around a through-hole conductor that extends through the magnetic material layer. The magnetic material surrounds the coil in multiple regions (inside the winding and outside in the thickness direction), forming a nested configuration that maximizes magnetic coupling and inductance.
2Device complexity
If magnetic sheet is used as internal layer substrate, then the inductor structure is simplified, but the insulating properties in planar direction are low
Solution Approach 1:
The patent applies local quality by using a through-hole insulator specifically at the locations where through-holes are formed in the magnetic material layer. This insulator provides localized high insulating properties in the planar direction at critical points, while the overall structure remains relatively simple. The insulator is positioned precisely where needed to prevent short circuits between conductor patterns on opposite surfaces.
3Quantity of substance
If through hole conductor is added to connect conductor patterns, then the inductance characteristics are improved, but the manufacturing complexity increases
Solution Approach 1:
The through-hole conductor serves multiple functions: it acts as the central axis around which the coil is wound, provides structural support for the magnetic material layer, enables electrical connection between conductor patterns on opposite surfaces, and creates a pathway for magnetic flux. This multi-functionality reduces the need for additional separate components, offsetting the increased structural complexity with functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves excellent insulating properties and inductance characteristics by ensuring magnetic material is present both inside and outside the inductor coil, improving the performance of the integrated inductor structure within the wiring substrate.
Implementation Method 1
a magnetic material layer that is provided inside the opening and has a first through hole formed to penetrate first and second main surfaces of the magnetic material layer
Implementation Method 2
a through hole conductor provided inside the second through hole and connecting the first conductor pattern to the second conductor pattern
Data Source
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AI summary
Provided is: a wiring substrate with built-in inductor having excellent insulating properties in planar direction and having excellent inductance characteristics by the presence of magnetic material not only inside an inductor coil but also outside the inductor coil; and a method for producing the same. The wiring substrate having an inductor function includes: an internal layer substrate that has first and second main surfaces and an opening formed to penetrate the first and the second main surfaces; a magnetic material layer that is provided inside the opening and has a first through hole formed to penetrate first and second main surfaces of the magnetic material layer; an insulator that is provided inside the first through hole and has a second through hole formed to penetrate the insulator; and an inductor including a first conductor pattern formed on the first main surface of the magnetic material layer, a second conductor pattern formed on the second main surface of the magnetic material layer, and a through hole conductor provided inside the second through hole and connecting the first conductor pattern to the second conductor pattern.