Inductor Built-in Substrate with Magnetic Resin
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Solution Overview
Problem
Existing inductor built-in substrates face challenges in achieving high inductance and heat dissipation due to low magnetic material ratios and inefficient heat transfer between conductors.
Innovation Solution
The inductor built-in substrate incorporates a core substrate with first and second through-hole conductors, where the second through-hole conductors are directly formed in a magnetic resin with iron oxide fillers, and both types of conductors are connected via lands with specific plating films, optimizing heat dissipation and inductance by balancing conductor thickness and magnetic material volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductors are formed in resin layers with low magnetic material ratios, then manufacturing is easier, but inductance is insufficient
Solution Approach 1:
The patent applies local quality by forming conductors in two distinct regions: first conductors in a first resin layer with a first magnetic material ratio, and second conductors in a second resin layer with a second magnetic material ratio that is higher than the first. This allows the inductor to have easier manufacturability in the first layer while achieving high inductance in the second layer with higher magnetic material content.
2Temperature
If conductor thickness is increased to improve heat dissipation, then heat transfer improves, but magnetic material volume decreases
Solution Approach 1:
The patent resolves this contradiction by creating local quality differentiation between two resin layers. The first resin layer contains thicker conductors for improved heat dissipation, while the second resin layer contains thinner conductors but has a higher magnetic material ratio to compensate and maintain overall inductance. This allows the inductor to achieve both adequate heat dissipation and sufficient magnetic material volume.
3Reliability
If conductor thickness is decreased to increase magnetic material volume, then inductance increases, but heat dissipation performance deteriorates
Solution Approach 1:
The patent addresses this contradiction by distributing conductor functions across two resin layers with different magnetic material ratios. The first layer with thicker conductors handles heat dissipation requirements, while the second layer with thinner conductors and higher magnetic material ratio maximizes inductance. This local differentiation allows both heat dissipation and inductance to be optimized simultaneously.
4Reliability
If magnetic material ratio is increased to improve inductance, then inductance increases, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the resin structure into two separate layers with different magnetic material ratios. The first resin layer has a lower magnetic material ratio for easier manufacturing, while the second resin layer has a higher magnetic material ratio for improved inductance. This segmentation allows each layer to be manufactured with appropriate complexity levels while achieving overall high inductance performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, reduces substrate size, and increases inductance by optimizing the magnetic material ratio and heat transfer between conductors.
Implementation Method 1
a magnetic resin filled in the openings and having second through holes, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film
Implementation Method 2
first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film
Data Source
AI summary
An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.