Inductor Built-in Substrate with Obtuse Angle Through Holes

The patent applies preliminary action by forming through holes in the magnetic resin before filling it into the openings. This sequence prevents the magnetic resin from interfering with hole formation and ensures proper hole geometry. The through holes are prepared in advance with appropriate angles and dimensions, then the magnetic resin is carefully filled and planarized to avoid voids and cracks, thus maintaining both high magnetic material ratio and structural integrity.

The patent employs parameter changes by optimizing the angle of the through holes (forming obtuse angles rather than right angles) and controlling the filling process parameters. The through holes are designed with specific angle ranges (e.g., 90-110 degrees) to facilitate proper resin filling and eliminate voids. Additionally, the planarization process parameters are controlled to achieve a flat upper surface while maintaining hole integrity, resolving the contradiction between maximizing magnetic material and ensuring reliability.

The patent applies asymmetry by changing the geometry of the through holes from right angles to obtuse angles. The through holes are formed with specific angle configurations (e.g., 90-110 degrees) that create a more favorable stress distribution pattern. This asymmetric geometry reduces stress concentration at the corners where conductor layers are present, preventing cracks while maintaining manufacturability through controlled formation processes.

The patent uses parameter changes by optimizing the angular parameters of the through holes. Instead of using standard right angles, the through holes are designed with specific angle ranges that balance stress reduction and manufacturing feasibility. The angle parameters are carefully controlled during the hole formation process to achieve the optimal geometry that prevents conductor layer cracking while keeping the manufacturing process practical.