Inductor Built-in Substrate With Staggered Magnetic Resin Holes

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Solution Overview

Problem

Existing inductor built-in substrates face challenges in increasing inductance due to a low ratio of magnetic material, which limits their performance.

Innovation Solution

The inductor built-in substrate incorporates a core substrate with first and second through-hole conductors, where the second through-hole conductors are directly formed in the magnetic resin, allowing for a higher volume of magnetic resin and increased inductance by forming multiple second through holes in a staggered pattern, enabling conductors to be placed at a narrow pitch.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the magnetic resin volume is increased to enhance inductance, then the inductance value improves, but the device size increases

Engineering Contradiction:
Improvemagnetic resin volumeVSAvoidinductor size
Core Design Contradiction:
Quantity of substanceVSVolume of moving object

Solution Approach 1:

The patent embeds multiple second through holes directly within the magnetic resin material itself, creating a nested structure where conductors are placed inside the magnetic material. This allows the magnetic resin to occupy more space (increasing inductance) without proportionally increasing the overall device footprint, as the conductors are nested within rather than surrounding the magnetic material.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from a planar arrangement of conductors to a three-dimensional structure by forming second through holes vertically through the magnetic resin. This vertical dimensionality allows conductors to be positioned at different heights within the magnetic resin volume, enabling increased magnetic material utilization without horizontal expansion of the device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If multiple second through holes are formed in a staggered pattern to increase conductor density, then the inductance improves, but the manufacturing complexity increases

Engineering Contradiction:
Improveconductor densityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent forms the magnetic resin with embedded second through holes as a preliminary step before forming the first through holes in the core substrate. This preliminary preparation of the magnetic resin structure with pre-formed conductor paths simplifies subsequent manufacturing steps, as the staggered pattern of second through holes is established early in the process rather than requiring complex post-processing.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11197373B2Inductor built-in substrate
Publication Date: 2021.12.07 IBIDEN CO LTD
  • US11197373B2 patent drawing
  • US11197373B2 patent drawing
  • US11197373B2 patent drawing

AI summary

An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening formed in the core substrate such that the magnetic resin has second through holes formed therein, a first through-hole conductor formed in the first through hole of the core substrate and including a metal film formed in the first through hole of the core substrate, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin, respectively.