Inductor Assembly with Extended Support Structures for Thermal Management
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Solution Overview
Problem
As electrical circuits are miniaturized, thermal management becomes increasingly difficult due to space limitations, making traditional heat sinks impractical, and existing inductors do not effectively remove heat from both the inductor and surrounding components without additional mounting hardware.
Innovation Solution
An inductor assembly comprising a magnetic core with electrically conductive material wound around it, featuring support structures that extend beyond the core to serve as both mechanical supports and heat sinks, allowing for efficient heat removal and component placement underneath without separate mounting hardware.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks are used for thermal management, then heat removal capability is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent combines the heat sink function with the inductor structure by making the support structures of the inductor assembly thermally conductive. These support structures simultaneously provide mechanical support for the inductor and serve as heat sinks to remove heat from both the inductor and adjacent components, eliminating the need for separate heat sink components.
Solution Approach 2:
The support structures of the inductor assembly are designed to perform multiple functions: mechanical support for the inductor, electrical connection, and thermal management. By making these structures thermally conductive, they become universal components that handle both structural and thermal requirements, reducing overall device complexity.
2Volume of moving object
If electrical circuits are miniaturized, then space utilization is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent integrates thermal management functionality directly into the inductor assembly structure. The support structures serve dual purposes as mechanical supports and heat dissipation pathways, allowing effective thermal management in miniaturized circuits without requiring additional space for separate heat sinks.
Solution Approach 2:
The patent utilizes the vertical dimension by extending support structures beyond the boundary of the magnetic core. This allows heat to be conducted upward from the circuit board through the inductor assembly, creating additional thermal management pathways in the vertical direction rather than requiring lateral expansion.
3Temperature
If separate mounting hardware is used for heat sinks, then heat removal effectiveness is improved, but device complexity and assembly steps increase
Solution Approach 1:
The patent merges the mounting hardware and heat sink functions into the inductor assembly itself. The support structures are integral parts of the inductor that simultaneously provide mechanical mounting and thermal conduction, eliminating the need for separate mounting hardware and simplifying assembly to a single component placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inductor assembly effectively manages heat from both itself and adjacent components, promoting miniaturization by integrating heat removal and mechanical support, thus addressing the thermal challenges in compact electrical circuits.
Implementation Method 1
The electrical conductive material has one or more support structures that extend beyond an outside boundary of the magnetic core... effectively manages heat from both itself and adjacent components
Data Source
AI summary
An inductor assembly comprising a first magnetic core and an electrically conductive material configured to wind around at least a portion of the first magnetic core. The electrical conductive material has one or more support structures that extend beyond an outside boundary of the first magnetic core.