Inductor Outer Terminal Structure for Precise Solder Mounting
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Solution Overview
Problem
The challenge in mounting inductor components on a substrate is the difficulty in controlling the amount of solder applied, which can result in either excessive or insufficient soldering, affecting the electrical connection quality.
Innovation Solution
The inductor component design includes vertical wiring exposed without obstruction, with a protruding distal end made of a low-melting-point alloy, allowing for solder-free mounting by ensuring an appropriate solder amount is used.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is applied to the substrate surface for mounting the inductor component, then the inductor component can be electrically connected to the substrate, but the amount of solder becomes difficult to control resulting in excessive or insufficient soldering
Solution Approach 1:
Instead of applying solder to the substrate and having the component soldered to it, the invention inverts the approach by making the outer terminal itself the solder portion. The outer terminal is formed with a low-melting-point alloy that serves as the solder, eliminating the need for separate solder application to the substrate. This inversion of roles (component terminal becomes the solder source) resolves the control issue entirely.
Solution Approach 2:
The outer terminal is designed to be self-sufficient by incorporating the solder material directly into its structure. The low-melting-point alloy portion of the outer terminal automatically provides the necessary solder for mounting, without requiring external solder application processes. This self-service approach ensures consistent solder amounts equal to the volume of the protruding terminal portion.
2Reliability
If the outer terminal is made of metal materials like copper, silver, tin, or nickel, then good electrical conductivity is achieved, but the melting point is too high for easy soldering
Solution Approach 1:
The outer terminal is designed with non-uniform material properties: the base portion maintains high-melting-point metal materials (copper, silver, tin, or nickel) for structural strength and electrical conductivity, while the distal end portion that protrudes is formed with a low-melting-point alloy specifically for soldering. This local differentiation of material quality allows simultaneous achievement of good electrical conductivity and easy soldering.
Solution Approach 2:
The outer terminal is constructed as a composite structure combining different materials with complementary properties. The base portion uses high-melting-point conductive metals, while the protruding solder portion uses low-melting-point alloys. This composite material approach allows the component to exhibit both high electrical conductivity from the metal base and easy solderability from the alloy tip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables precise solder application, preventing excessive or insufficient soldering, thereby ensuring reliable electrical connections.
Implementation Method 1
The at least part of the outer terminal includes a distal end that protrudes and that is a solder portion which is made of an alloy of tin lower in melting point than the inductor wiring and the vertical wiring
Data Source
AI summary
A body of an inductor component includes a magnetic layer, a first insulating resin, a second insulating resin, and an insulating layer. First inductor wiring extends along a principal surface of the body, inside the magnetic layer. First vertical wiring is connected to an upper surface of a first pad of the first inductor wiring. An upper surface of the first vertical wiring is exposed without being obstructed by the principal surface. A first outer terminal is connected to the upper surface of the first vertical wiring and protrudes from the principal surface upward in a thickness direction. The first outer terminal includes a metal layer covering the upper surface of the first vertical wiring and a solder portion on an upper surface of the metal layer. An upper portion including a protruding distal end of the first outer terminal is the solder portion made of a tin alloy.