Thermally Conductive Inductor Assembly for Heat Dissipation
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Solution Overview
Problem
The reduction in size of electrical inductors in aerospace systems complicates heat dissipation due to reduced surface area and poor thermal conductivity of current materials, which is critical given the high temperature sensitivity of the core material and wires.
Innovation Solution
An electrical inductor assembly featuring a thermally conductive wire guide and outer housing with a high thermal conductivity compound within slots to facilitate heat dissipation, coupled with a heat sink arrangement for effective thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If the size of the inductor is reduced, then the weight and volume are decreased, but the surface area is reduced making heat dissipation more difficult
Solution Approach 1:
A thermally conductive compound is introduced as an intermediary substance between the inductor core and the cooling elements (heat sink/cold plate). This compound enhances the thermal coupling efficiency, allowing effective heat transfer from the compact inductor core to the cooling elements despite the reduced surface area available for direct contact.
2Ease of manufacture
If conventional materials are used, then manufacturing is simpler, but thermal conductivity is poor hindering heat dissipation
Solution Approach 1:
The patent employs a composite material solution by using a thermally conductive compound (such as epoxy with thermal conductive fillers like aluminum oxide or boron nitride) instead of conventional potting materials. This composite material provides both the ease of application (similar to conventional potting compounds) and superior thermal conductivity to enable effective heat dissipation from the inductor core.
3Volume of stationary object
If the inductor core is compacted, then volume is reduced for aerospace applications, but heat dissipation becomes more difficult
Solution Approach 1:
The thermally conductive compound serves as a mediator that bridges the gap between the compacted inductor core and the cooling elements. It fills the interstitial spaces and creates efficient thermal pathways, enabling heat to be conducted away from the high-density core structure despite the reduced volume and limited surface area for heat dissipation.
Solution Approach 2:
The cooling system with heat sink and cold plate provides a counterbalancing thermal management solution that compensates for the heat dissipation challenges created by core compaction. The high thermal conductivity compound ensures that heat generated in the compact core is efficiently transferred to the cooling elements, maintaining thermal balance despite the reduced volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capabilities, improving the efficiency and reliability of electrical inductors in high-temperature applications by effectively coupling the inductor core and wires to cooling elements.
Implementation Method 1
a high thermal conductivity compound disposed within at least one of the plurality of slots to thermally couple the inductor core and the plurality of wires to the cooling elements
Data Source
AI summary
An electrical inductor assembly, 10, includes an inductor core, 14, having a relatively circular geometry. Also included is a wire guide, 12, surrounding and retaining the inductor core, 14, the wire guide, 12, having a plurality of slots, 16, for retaining and guiding a plurality of wires. Further included is an outer housing, 40, surrounding and retaining the wire guide, 12, and a substance, 30, disposed within at least one of the plurality of slots, 16, of the wire guide, 12.