Layered Thermal Potting for Inductor Heat Dissipation
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Solution Overview
Problem
Existing inductors face issues with high manufacturing costs and weight due to the use of thermally conductive packaging materials with high heat dissipation performance, leading to inefficient heat dissipation and stability problems.
Innovation Solution
The inductor design incorporates a thermally conductive packaging material with varying thermal conductivity layers, where a higher conductivity layer is closer to the heat dissipation wall for efficient heat transfer, and a lower conductivity layer is used in less critical areas to reduce costs and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive packaging material with high heat dissipation performance is used, then heat dissipation effect is improved, but manufacturing costs and weight increase
Solution Approach 1:
The patent applies local quality by using different thermally conductive packaging materials with different thermal conductivities in different regions. The first thermally conductive packaging material with higher thermal conductivity is used in the first region closer to the heat dissipation wall, while the second thermally conductive packaging material with lower thermal conductivity is used in the second region farther from the heat dissipation wall. This regional differentiation optimizes heat dissipation where needed while reducing weight and cost in less critical areas.
2Temperature
If a thermally conductive packaging material with high heat dissipation performance is used, then heat dissipation effect is improved, but manufacturing costs increase
Solution Approach 1:
The patent implements local quality by strategically placing high-performance thermally conductive packaging material only in the first region near the heat dissipation wall where heat dissipation is most critical, while using lower-cost materials in the second region. This approach maintains effective heat dissipation while significantly reducing overall manufacturing costs compared to using high-performance material throughout the entire structure.
Solution Approach 2:
The patent segments the thermally conductive packaging material into two distinct regions with different material properties. The first region uses high thermal conductivity material for critical heat dissipation, while the second region uses lower thermal conductivity material for cost reduction. This segmentation allows optimization of both performance and cost by matching material properties to functional requirements in different zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves effective heat dissipation with reduced manufacturing costs and weight, ensuring stable operation by quickly dissipating heat generated by the inductor.
Implementation Method 1
a coefficient of thermal conductivity of the first packaging layer is greater than a coefficient of thermal conductivity of the second packaging layer. The housing includes a heat dissipation wall and a packaging wall, and the first packaging layer is closer to the heat dissipation wall than the second packaging layer
Implementation Method 2
heat generated by the inductor winding is transferred to the housing through the thermally conductive packaging material, and then the heat is dissipated through the housing
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
An inductor (100) is provided, and includes an inductor winding (10), a housing (20), and a thermally conductive packaging material (30). The inductor winding is disposed in the housing. The thermally conductive packaging material is potted in the housing to fill a gap between the inductor winding and the housing. The thermally conductive packaging material includes a first packaging layer (31) and a second packaging layer (32), and a coefficient of thermal conductivity of the first packaging layer is greater than a coefficient of thermal conductivity of the second packaging layer. The housing includes a heat dissipation wall (21) and a packaging wall (22), and the first packaging layer is closer to the heat dissipation wall than the second packaging layer. Heat generated by the inductor can be dissipated after being transmitted to each surface of the housing through the thermally conductive packaging material. A surface area of the housing is larger than that of the inductor winding. This can increase a surface area for heat exchange between the inductor and the outside, to increase a heat dissipation coefficient. In addition, thermally conductive packaging materials with different coefficients of thermal conductivity are potted at different positions in the housing, to ensure that when the inductor can efficiently dissipate heat, manufacturing costs and a weight of the inductor are reduced.