Embedded Inductor Thermal Vent Structures for Package Cooling
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Solution Overview
Problem
Microelectronic packages with embedded inductors face limitations in processor current levels due to thermal constraints, leading to reduced performance as they throttle back to avoid damaging the inductors, limiting both current and time in high-power modes.
Innovation Solution
Incorporating thermal vent structures within the package substrate and board to provide a cooling pathway for the inductor, allowing for increased current delivery and reduced heat buildup, thereby enhancing inductor performance and preventing thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inductor current limits are enforced to avoid thermal damage, then inductor reliability is improved, but processor performance deteriorates due to current throttling
Solution Approach 1:
The patent introduces thermal vent structures that create a new thermal dissipation dimension by forming channels through the substrate, allowing heat to escape vertically from the inductor region. This dimensional approach to heat management enables higher current operation without compromising inductor reliability
Solution Approach 2:
The thermal vent structures act as intermediary elements between the inductor and the external environment, providing a dedicated heat transfer pathway. These vent structures mediate the thermal interaction, allowing the inductor to operate at higher currents while maintaining reliability through improved heat dissipation
2Productivity
If processor current levels are increased, then processor performance is improved, but inductor thermal damage risk increases
Solution Approach 1:
The patent extracts heat from the inductor region by introducing thermal vent structures that create dedicated escape pathways for thermal energy. By taking heat out of the system through these vent channels, the inductor can sustain higher current levels without reaching damaging temperature thresholds
Solution Approach 2:
The thermal vent structures function similarly to pneumatic or hydraulic flow channels, creating a controlled pathway for thermal energy to flow from the inductor through the substrate to the external environment. This flow-based approach to heat management enables sustained high-current operation
3Temperature
If thermal vent structures are added to the substrate, then inductor cooling is improved, but device complexity increases
Solution Approach 1:
The thermal vent structures are integrated into the substrate in a way that allows the substrate to serve multiple functions: its original electrical and mechanical functions plus the new thermal management function. By making the substrate multi-functional, the patent avoids adding separate complex cooling systems while still achieving effective inductor cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal vent structures effectively cool the inductor, enabling higher current levels and extended operation times without throttling, thus improving CPU performance and preventing thermal damage to the inductor.
Implementation Method 1
the package substrate comprises thermal vent structures that extend through a thickness of the package substrate and provide cooling for the inductor
Data Source
AI summary
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.