Inductor Coil Layout With Reinforced Via Contact Under Mounting Stress
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Solution Overview
Problem
The existing inductor components face disconnection issues between via wiring layers and coil wiring layers due to thermal or bending stress when mounted on a mounting board, particularly in downsized designs.
Innovation Solution
The inductor component design features a larger contact area between the bottom surface-side via wiring layer and the coil wiring layer by positioning the via wiring layers such that the central point of each via wiring layer is on either the bottom or top surface side of the element body, with the contact area between the bottom surface-side via wiring layer being larger than that of the top surface-side via wiring layer, enhancing connection strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inductor component is downsized, then the size of the inductor component is reduced, but the connection strength between the via wiring layer and the coil wiring layer deteriorates due to thermal stress or bending stress from the mounting board
Solution Approach 1:
The patent applies local quality by making the contact area between the via wiring layer and coil wiring layer asymmetric: the bottom surface-side via wiring layer has a larger contact area with the coil wiring layer than the top surface-side via wiring layer. This localized differentiation in contact area provides enhanced connection strength specifically at the bottom surface where mounting board stress is applied, resolving the contradiction between downsizing and maintaining connection strength.
2Adaptability or versatility
If the inductor component is mounted on a mounting board, then the inductor component can be used in practical applications, but disconnection occurs between the via wiring layer and the coil wiring layer due to thermal stress or bending stress
Solution Approach 1:
The patent makes the contact area between the via wiring layer and coil wiring layer non-uniform, with the bottom surface-side via wiring layer having a larger contact area than the top surface-side via wiring layer. This local quality enhancement at the stress-prone bottom surface prevents disconnection while maintaining overall mountability.
Solution Approach 2:
The patent design anticipates the thermal stress and bending stress that will occur during mounting and operation, and pre-compensates for these stresses by creating an asymmetric contact area distribution. The larger contact area at the bottom surface acts as a preliminary reinforcement against the expected mounting stresses, preventing disconnection before it occurs.
Data Source
AI summary
An inductor component includes an element body, a coil in the element body and helically wound along an axis, and first and second outer electrodes at the element body and electrically connected to the coil. The element body includes first and second end surfaces facing each other, first and second lateral surfaces facing each other, a bottom surface connected between the first and second end surfaces and between the first and second lateral surfaces, and a top surface facing the bottom surface. The first and second outer electrodes are provided to at least the bottom surface. The axis is parallel to the bottom surface and intersects the first and second lateral surfaces. The coil includes coil wiring layers laminated along the axis, and via wiring layers each connecting the coil wiring layers adjacent in a direction of the axis.