Inductor Built-in Wiring Board Shield Function
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Solution Overview
Problem
Existing inductor built-in wiring boards face challenges in reducing device size due to the need for discrete coils and complex component management, with difficulties in achieving desired inductance values and resonance frequencies while maintaining a compact form factor.
Innovation Solution
A wiring board with a shield function is designed, featuring conductive shield patterns surrounding electronic component areas and an inductor formed between these patterns, where the inductor is electrically coupled via inner layers and covered with an insulating material, allowing for efficient use of space and shielding to prevent magnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete coils are soldered onto the printed circuit board, then inductor functionality is achieved, but component management becomes complicated and device size increases
Solution Approach 1:
The patent merges the inductor coil structure directly into the printed circuit board by forming conductive patterns on the board surface. The coil pattern is integrated with the PCB structure, eliminating the need for separate discrete coil components. This integration reduces component management complexity while maintaining reliable electrical connections through the board's conductive traces and vias.
Solution Approach 2:
The printed circuit board serves multiple functions: it provides mechanical support, electrical connections, and inductor functionality simultaneously. The conductive patterns on the PCB serve both as circuit interconnects and as the inductor coil structure, reducing the total component count and simplifying assembly while improving mounting reliability.
2Reliability
If discrete coils are mounted on the printed circuit board, then inductor functionality is achieved, but considerable mounting space is required
Solution Approach 1:
The inductor coil is merged with the PCB structure by forming conductive patterns directly on the board surface. This integration eliminates the need for separate mounting space for discrete coils, as the inductor functionality is achieved within the existing board footprint. The conductive patterns utilize the board's surface area efficiently, reducing overall device size.
3Device complexity
If a coil is formed on the printed circuit board with a conductive pattern, then component mounting is simplified, but the pattern size must be increased to achieve desired inductance values
Solution Approach 1:
The patent utilizes the vertical dimension by forming multi-layer conductive patterns on the PCB. The coil structure extends through multiple layers of the board, with conductive patterns on different layers connected via vias. This three-dimensional configuration increases the effective inductance within a smaller planar footprint, achieving desired inductance values without excessive pattern area.
Solution Approach 2:
The conductive patterns are arranged in nested or overlapping configurations across multiple PCB layers. The coil pattern on one layer is positioned to maximize magnetic flux linkage with patterns on adjacent layers, effectively nesting the magnetic fields. This nested arrangement increases inductance density, allowing smaller pattern areas to achieve the same inductance values.
4Area of stationary object
If inductors are formed on the wiring board, then device size is reduced, but magnetic field interference with other components occurs
Solution Approach 1:
The patent converts the harmful magnetic field radiation into a beneficial contained magnetic flux by providing magnetic shielding. The shielding structure, formed with conductive and magnetic materials, captures the magnetic field lines generated by the inductor patterns and redirects them through controlled paths. This converts the harmful radiative interference into contained magnetic flux that can be directed away from sensitive components, reducing electromagnetic interference while maintaining compact inductor integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the achievement of high inductance values and resonance frequencies while minimizing board area, improving wiring density and reducing noise interference with other components.
Implementation Method 1
An electric current 5 is allowed to flow in the coil 2, thereby generating a magnetic flux 6
Implementation Method 2
the inductor is covered with a shield 3... conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area
Data Source
AI summary
There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at least one inductor formed of a conductive pattern and provided between the conductive shield patterns.