Inert Anode Electroplating Replenisher
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Solution Overview
Problem
Electroplating processors using consumable anodes are complex and costly, while inert anode systems face challenges in maintaining metal ion concentration and generating defects, necessitating a more efficient and cost-effective solution for semiconductor manufacturing.
Innovation Solution
An electroplating processor with an inert anode and a vessel-catholyte replenisher system that circulates electrolyte and adds metal ions through a catholyte membrane or directly, maintaining metal ion concentration and reducing chamber complexity and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If consumable anodes are used, then metal ion concentration is maintained effectively, but device complexity and cost increase
Solution Approach 1:
The patent extracts the anode function from the plating chamber by using a separate replenisher system. The replenisher contains the consumable anode material and transfers metal ions to the plating bath through a membrane, separating the consumption function from the plating function and reducing chamber complexity.
Solution Approach 2:
The patent introduces a membrane as an intermediary between the replenisher and the plating chamber. This membrane allows selective transfer of metal ions while keeping the consumable anode material contained in the replenisher, enabling maintenance of metal ion concentration without direct anode replacement in the chamber.
2Quantity of substance
If consumable anodes are used, then metal ion replenishment is achieved, but maintenance requirements increase
Solution Approach 1:
The consumable anode is extracted from the plating chamber and placed in a separate replenisher system. This allows the anode to be consumed and replenished outside the main chamber, reducing maintenance interruptions to the plating process and improving ease of repair.
Solution Approach 2:
The replenisher system is designed to automatically transfer metal ions from the consumable anode to the plating bath through the membrane. This self-service mechanism reduces the need for manual intervention and maintenance of the anode system.
3Device complexity
If inert anodes are used, then device complexity is reduced, but metal ion concentration cannot be maintained
Solution Approach 1:
The membrane acts as an intermediary that enables metal ion transfer from the replenisher to the plating chamber while using inert anodes. This allows the inert anode system to maintain metal ion concentration through the replenisher-membrane mechanism, resolving the contradiction between simplicity and effectiveness.
Solution Approach 2:
The metal ion replenishment function is extracted from the anode itself and placed in a separate replenisher system. This allows inert anodes to be used in the plating chamber while maintaining metal ion concentration through the external replenisher, combining the benefits of simplicity and effectiveness.
4Ease of repair
If inert anodes are used, then maintenance is reduced, but gas generation causes defects
Solution Approach 1:
The harmful gas generation is extracted from the plating chamber by placing the consumable anode in a separate replenisher system. The gas is generated in the replenisher rather than in the plating chamber, preventing defects on the workpiece while maintaining reduced maintenance requirements.
Solution Approach 2:
The membrane serves as an intermediary that separates the gas generation zone (replenisher) from the plating zone. This allows gas to be generated in the replenisher without affecting the plating process, eliminating defects while maintaining the benefits of the inert anode system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the electroplating processor design, maintains stable metal ion concentration, and increases uptime by centralizing copper replenishment, allowing for higher plating rates and improved feature morphology without the need for frequent maintenance.
Implementation Method 1
The vessel-catholyte replenisher adds metal ions into the vessel-catholyte by moving ions of a bulk metal through a catholyte membrane in the vessel-catholyte replenisher
Implementation Method 2
use of inert anodes has led to other disadvantages, especially related to maintaining the metal ion concentration in a cost effective manner compared to consumable anodes and the generation of gas at the inert anode
Implementation Method 3
Metal ions in the electrolyte plate out onto the wafer, creating a metal layer on the wafer
Data Source
AI summary
An electroplating processor has a vessel holding an electrolyte. An inert anode in the vessel has an anode wire within an anode membrane tube. A head for holds a wafer in contact with the electrolyte in the vessel. The wafer is connected to a cathode. A catholyte replenisher is connected to the vessel. The catholyte replenisher adds metal ions into the catholyte by moving ions of a bulk metal through a catholyte membrane in the catholyte replenisher.