Inert Gas Recycling in Semiconductor Substrate Processing
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Solution Overview
Problem
Current substrate processing apparatuses in semiconductor manufacturing consume excessive inert gases, particularly nitrogen (N2), which is inefficient and costly.
Innovation Solution
The apparatus incorporates a second inert gas supply system that recycles and reuses inert gases discharged from the transfer chamber, supplying them to the processing chamber or its downstream portions, thereby reducing overall consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inert gas is supplied to the transfer chamber and processing chamber, then the substrate processing can be performed, but the consumption amount of inert gas increases
Solution Approach 1:
The patent recovers inert gas discharged from the transfer chamber exhaust system and reuses it in the processing chamber. The exhaust gas from the transfer chamber is collected through the first exhauster, and the inert gas component is recovered and supplied to the processing chamber via the second inert gas supplier, preventing waste of the inert gas while maintaining processing quality
Solution Approach 2:
The system uses its own exhaust inert gas to supply the processing chamber, creating a self-sustaining gas circulation system. The inert gas discharged from the transfer chamber serves itself by being reused in the processing chamber, reducing external gas consumption
2Manufacturing precision
If fresh inert gas is continuously supplied to the processing chamber, then the processing gas quality is maintained, but the cost and consumption increase
Solution Approach 1:
The patent establishes a continuous inert gas circulation system where gas is continuously recovered from the transfer chamber exhaust and continuously supplied to the processing chamber. This continuous circulation maintains gas quality without the need for continuous fresh gas supply, reducing overall consumption while preserving processing precision
Data Source
AI summary
There is provided is a technique includes: at least one processing chamber in which a substrate is processed; a processing gas supplier that supplies a processing gas to the at least one processing chamber; a transfer chamber communicable with the at least one processing chamber; a first inert gas supplier that supplies an inert gas to the transfer chamber; a first exhauster that discharges an atmosphere from the transfer chamber; and a second inert gas supplier that supplies the inert gas discharged by the first exhauster to the at least one processing chamber or a downstream portion of the at least one processing chamber.


