Inert Gas Supply Opening Orientation for Substrate Liquid Processing

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Solution Overview

Problem

Existing substrate liquid processing technologies face challenges in stabilizing the processing of substrates under low oxygen atmospheres while preventing scattering of processing liquids, which can lead to unstable and inefficient processing.

Innovation Solution

A substrate liquid processing apparatus that includes a substrate holder, a processing liquid supply, a cover body to cover the substrate, and a gas supply system to direct inert gas between the substrate and the cover body, ensuring a low oxygen atmosphere and minimizing direct gas discharge onto the substrate surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If inert gas is supplied to the space around the substrate under the cover body, then oxidation of processing liquid is suppressed and processing stability is improved, but processing liquid scattering occurs leading to unstable processing

Engineering Contradiction:
Improveprocessing stabilityVSAvoidprocessing liquid scattering
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The gas supply opening is positioned at a specific location on the cover body where inert gas is supplied in advance to the space around the substrate before processing begins. This preliminary action allows the inert gas to establish a protective atmosphere without directly contacting the processing liquid, thereby preventing both oxidation and scattering.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The cover body acts as an intermediary structure that facilitates inert gas supply to the substrate environment. The gas supply opening on the cover body directs inert gas into the enclosed space, creating a low oxygen atmosphere that protects the processing liquid without requiring direct gas contact with the liquid surface, thus avoiding scattering while preventing oxidation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If inert gas is supplied directly onto the substrate surface, then low oxygen atmosphere is achieved quickly, but processing liquid scatters causing unstable processing

Engineering Contradiction:
Improvelow oxygen atmosphere establishmentVSAvoidprocessing liquid stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The gas supply opening is positioned at a specific location on the cover body to deliver inert gas to a specific region (the space around the substrate) rather than directly onto the substrate surface. This localized gas supply creates the desired low oxygen atmosphere in the target area without disrupting the processing liquid on the substrate.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of supplying inert gas in a horizontal direction directly onto the substrate surface (2D contact), the gas supply opening delivers inert gas from above through the cover body (3D spatial distribution). This dimensional change allows the inert gas to fill the enclosed space and establish a low oxygen atmosphere without direct contact with the processing liquid, preventing scattering while achieving the desired atmospheric composition.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for stable and efficient liquid processing by maintaining a low oxygen atmosphere around the substrate, reducing oxidation and scattering of processing liquids, thereby enhancing processing stability and quality.

Implementation Method 1

a gas supply configured to supply an inert gas to a space between the substrate held by the substrate holder and the cover body

Methodology Applied
Scientific EffectInert gas supply:

Implementation Method 2

a cover body configured to cover the upper surface of the substrate held by the substrate holder

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Implementation Method 3

a processing liquid supply configured to supply a processing liquid to an upper surface of the substrate held by the substrate holder

Methodology Applied
Scientific EffectLiquid supply:

Data Source

PatentUS20220049356A1Substrate liquid processing apparatus and substrate liquid processing method
Publication Date: 2022.02.17 TOKYO ELECTRON LTD
  • US20220049356A1 patent drawing
  • US20220049356A1 patent drawing
  • US20220049356A1 patent drawing

AI summary

A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a processing liquid supply configured to supply a processing liquid to an upper surface of the substrate held by the substrate holder; a cover body configured to cover the upper surface of the substrate held by the substrate holder; and a gas supply configured to supply an inert gas to a space between the substrate held by the substrate holder and the cover body, the gas supply having a gas supply opening through which the inert gas is discharged. An opening direction of the gas supply opening is directed to a direction other than the upper surface of the substrate held by the substrate holder.