Chemically Inert O-Ring Seals for Accurate Fluid Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing fluid sensing packages face issues with seals that do not adhere optimally, lack mechanical robustness, are not chemically inert, cause ion absorption and out-diffusion, and increase manufacturing costs due to non-standard integration techniques.
Innovation Solution
The use of o-ring seals composed of chemically inert materials like PEEK or PTFE, which are compressed to circumscribe the sensor, funnel fluid towards it, and are highly conformal, preventing ion absorption and fluid ingress, while being durable and cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional seals are used in fluid sensing packages, then manufacturing costs increase due to non-standard integration techniques, but seal performance and reliability are compromised
Solution Approach 1:
The patent changes the material parameter of the seal from conventional materials to chemically inert materials (PEEK, PTFE) that match the chemical properties of the fluid being sensed. This parameter change enables both cost-effective manufacturing through standard techniques and reliable seal performance by preventing chemical interactions.
Solution Approach 2:
The patent creates a chemically inert sealing environment by using seals made from chemically inert materials that do not react with the fluid being sensed. This inert environment prevents ion absorption and out-diffusion, maintaining measurement accuracy while allowing integration with existing manufacturing processes.
2Ease of manufacture
If conventional seals are used, then manufacturing costs increase, but the seals cause ion absorption and out-diffusion that reduces measurement accuracy
Solution Approach 1:
The patent creates a chemically inert sealing environment by using seals made from chemically inert materials that do not react with the fluid being sensed. This inert environment prevents ion absorption and out-diffusion, maintaining measurement accuracy while allowing integration with existing manufacturing processes.
Solution Approach 2:
The patent employs composite material selection by choosing chemically inert materials (PEEK, PTFE) that combine chemical inertness with mechanical sealing properties. This material selection prevents ion interference while maintaining seal integrity, achieving both cost-effective manufacturing and high measurement precision.
3Ease of manufacture
If non-chemically inert seals are used, then manufacturing is simpler, but the seals are not durable under temperature fluctuations
Solution Approach 1:
The patent changes the material parameter of the seal from conventional materials to chemically inert materials (PEEK, PTFE) that match the chemical properties of the fluid being sensed. This parameter change enables both cost-effective manufacturing through standard techniques and reliable seal performance by preventing chemical interactions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The o-ring seals provide a reliable, accurate, and cost-effective solution that withstands temperature fluctuations, prevents ion interference, and maintains measurement accuracy, facilitating integration with existing technologies.
Implementation Method 1
a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die
Implementation Method 2
The o-ring seals are highly conformal, preventing ion absorption and fluid ingress
Implementation Method 3
The use of o-ring seals composed of chemically inert materials like PEEK or PTFE, which are compressed to circumscribe the sensor, funnel fluid towards it, and are highly conformal, preventing ion absorption and fluid ingress
Data Source
AI summary
In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.


