Inertial Sensor Unit Board Segmentation for Size Reduction
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Solution Overview
Problem
Existing inertial sensor units face challenges in minimizing size due to the need for multiple inertial sensor modules and processing circuits on the same board, leading to increased size and potential interference between components.
Innovation Solution
The inertial sensor unit design separates inertial sensor modules onto a first board and the processing circuit onto a second board, allowing for overlapping arrangement to reduce size and prevent heat and vibration interference, with the inertial sensor modules being packaged in metal cases for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple inertial sensor modules and processing circuit are mounted on the same board, then signal processing can be performed, but the planar size is increased
Solution Approach 1:
The patent divides the system into two separate boards: a first board for mounting inertial sensor modules and a second board for mounting the processing circuit. This segmentation allows each board to be optimized for its specific function while reducing the overall planar size compared to mounting all components on a single board.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by placing the first board and second board in overlapping positions. This dimensional change enables compact integration while maintaining functional separation between sensor modules and processing circuit.
2Reliability
If the number of inertial sensor modules is increased to stabilize characteristics, then measurement stability is improved, but the size of the board is increased
Solution Approach 1:
By separating the inertial sensor modules onto a dedicated first board, the patent enables flexible arrangement of multiple sensor modules without being constrained by the need to fit them all on a single board with the processing circuit. This segmentation allows optimization of sensor module density and arrangement for stable characteristics while maintaining compact overall size.
3Device complexity
If inertial sensor modules and processing circuit are mounted on the same board, then signal processing can be performed, but more pieces of signal processing are required leading to increased processing circuit size
Solution Approach 1:
The patent separates the processing circuit onto a second board, allowing it to be designed with optimized signal processing capabilities independent of the sensor module arrangement. This segmentation enables the processing circuit to be sized appropriately for the specific signal processing requirements rather than being constrained by the need to accommodate multiple sensor modules on the same board.
Data Source
AI summary
An inertial sensor unit includes a first board on which a plurality of inertial sensor modules are mounted, and a second board on which a processing circuit configured to process signals from a plurality of inertial sensor modules is mounted.