Inertial Sensor Holding Structure with Segmented Bonding and Pressing
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Solution Overview
Problem
Existing inertial sensors face challenges in maintaining measurement accuracy due to vibrations and shocks, which affect the precision of sensors like acceleration and angular velocity sensors.
Innovation Solution
A holding structure with multiple connection points using a combination of adhesive bonding and pressing mechanisms to securely attach the inertial sensor substrate to a target, ensuring stability and minimizing the impact of vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an inertial sensor is placed on a substrate without proper holding structure, then the device complexity is reduced, but the measurement precision deteriorates due to vibrations and shocks
Solution Approach 1:
The holding structure is divided into multiple connection structure portions (at least two) that are respectively provided to at least two portions of the substrate. This segmentation distributes the vibration isolation function across multiple points, improving measurement precision without requiring a single complex holding mechanism.
Solution Approach 2:
The connection structure portions serve multiple functions: they mechanically connect the substrate to the target, provide vibration isolation through elastic bodies, and enable both bonding and pressing fixation methods. This multi-functionality improves measurement accuracy while avoiding the need for separate dedicated vibration isolation components.
2Reliability
If a single connection structure is used to attach the substrate, then the ease of manufacture is improved, but the reliability deteriorates due to insufficient vibration isolation
Solution Approach 1:
The connection structure is segmented into at least two connection structure portions distributed at different locations on the substrate. This segmentation enhances reliability by providing multiple attachment points that collectively improve vibration isolation, while each individual connection portion remains simple to manufacture using standard bonding or pressing techniques.
Solution Approach 2:
Elastic bodies are locally integrated into the connection structure portions to provide vibration isolation at specific connection points. This local quality approach ensures stable substrate attachment and reliable vibration damping without requiring complex global structural modifications, maintaining ease of manufacture.
3Strength
If adhesive material is applied extensively between target and substrate, then the bonding strength is improved, but the manufacturing precision deteriorates due to adhesive overflow and positioning difficulty
Solution Approach 1:
The bonding interface is segmented into at least two discrete connection structure portions rather than a continuous adhesive layer. This segmentation concentrates adhesive application to specific localized areas, ensuring adequate bonding strength at each connection point while preventing adhesive overflow and maintaining positioning accuracy during assembly.
Solution Approach 2:
Elastic bodies serve as intermediaries between the substrate and target at the connection portions. These elastic bodies provide a controlled interface that facilitates precise positioning during assembly, allows for accurate alignment before bonding, and ensures consistent bonding strength without adhesive overflow affecting manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances the measurement accuracy of inertial sensors by stabilizing the substrate and reducing the impact of vibrations, leading to improved performance in applications such as image-capturing systems.
Implementation Method 1
a bonding structure obtained by an adhesive material being provided between the target and substrate being spaced from each other
Implementation Method 2
a pressing structure obtained by the substrate being pressed against the target to be fixed to the target
Data Source
AI summary
A holding structure according to an embodiment of the present technology is a holding structure that is used to provide, to a target, a substrate on which an inertial sensor is arranged, and the holding structure includes at least two connection structure portions. The at least two connection structure portions are respectively provided to at least two portions of the substrate, and connects the substrate to the target. Further, the at least two connection structure portions each have a bonding structure obtained by an adhesive material being provided between the target and substrate being spaced from each other; or one of the at least two connection structure portions has a pressing structure obtained by the substrate being pressed against the target to be fixed to the target, and another of the at least two connection structure portions has the bonding structure.