Inertial Sensor Thermal Isolation via Segmented Circuit Boards
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Solution Overview
Problem
Inertial measurement devices face reduced detection accuracy due to heat transfer from heat-generating components on the board to the inertial sensor, affecting temperature stability and performance.
Innovation Solution
The inertial measurement device separates the first circuit board with low-heat-generating components from the second circuit board with heat-generating components, using a housing to create longer heat transfer paths and employing a flexible cable to further isolate the inertial sensor, thereby minimizing heat transfer and maintaining detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat-generating components are mounted on the same circuit board as the inertial sensor, then device integration is improved, but detection accuracy deteriorates due to heat transfer
Solution Approach 1:
The patent divides the circuit board into two separate boards: a first circuit board mounted with the inertial sensor and a second circuit board mounted with heat-generating components. This segmentation physically separates the heat source from the sensor, preventing heat transfer while maintaining device functionality.
Solution Approach 2:
The heat-generating components are extracted from the same board as the inertial sensor and relocated to a separate second circuit board. This extraction removes the harmful thermal influence from the sensor environment while preserving the overall system integration.
2Area of stationary object
If heat-generating components are placed close to the inertial sensor, then space utilization is improved, but temperature stability deteriorates
Solution Approach 1:
The patent segments the device into two spatially separated circuit boards, placing the inertial sensor on the first board and heat-generating components on the second board. This segmentation creates physical distance between heat sources and the sensor, ensuring temperature stability while maintaining compact overall design.
3Ease of manufacture
If a single circuit board is used for both sensor and heat-generating components, then manufacturing simplicity is improved, but sensor performance deteriorates
Solution Approach 1:
The patent employs two separate circuit boards instead of a single board. The first circuit board is dedicated to the inertial sensor with minimal heat-generating components, while the second circuit board handles heat-generating components. This segmentation improves sensor performance and reliability while maintaining manufacturing feasibility through standardized board designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents temperature changes in the inertial sensor, stabilizing detection accuracy and enhancing the device's measurement characteristics.
Implementation Method 1
using a housing to create longer heat transfer paths and employing a flexible cable to further isolate the inertial sensor, thereby minimizing heat transfer
Data Source
AI summary
An inertial measurement device includes: an inertial sensor; a first circuit board disposed on one side of the inertial sensor; a second circuit board that is disposed on an opposite side of the first circuit board from the inertial sensor and on which a heat-generating component is mounted; and a housing configured to accommodate the inertial sensor, the first circuit board, and the second circuit board. The first circuit board and the second circuit board are separated from each other and are electrically coupled to each other via a cable.