Inertial Sensor Module Stress Buffering via Substrate Segmentation
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Solution Overview
Problem
Inertial sensor modules face challenges in maintaining detection accuracy when subjected to external fluctuations such as temperature changes and bending stresses, which can lead to decreased reliability and accuracy in measuring physical quantities like angular velocity and acceleration.
Innovation Solution
The inertial sensor module incorporates a substrate with distinct regions and slits to alleviate stress, featuring first and second inertial sensors mounted on the substrate, with slits and support portions surrounding the sensor regions to buffer external fluctuations, ensuring the sensors' accuracy and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If inertial sensors are mounted on a substrate without stress-alleviating structures, then the device complexity is reduced, but the detection accuracy decreases under external fluctuations such as temperature changes and bending stresses
Solution Approach 1:
The substrate is divided into multiple regions (first region for mounting inertial sensors, second region surrounding it, and third region between them) with slits provided between these regions. This segmentation allows different parts of the substrate to have different functions: the first region maintains detection accuracy while the second and third regions with slits absorb external stresses, thus resolving the contradiction between maintaining simple structure and ensuring measurement precision under external fluctuations.
2Reliability
If slits are provided between substrate regions to buffer external stresses, then the reliability under external fluctuations is improved, but the manufacturing complexity increases
Solution Approach 1:
The substrate is segmented into distinct regions with slits between them, creating a modular structure that can be manufactured using standard PCB fabrication techniques. The slits are simply gaps in the substrate material that can be created during the manufacturing process, allowing the substrate to flex and absorb stresses without requiring complex additional components or assembly steps, thus maintaining ease of manufacture while improving reliability.
3Measurement precision
If multiple regions with slits are provided to surround the sensor region, then the suppression of detection accuracy decrease is enhanced, but the device complexity increases
Solution Approach 1:
The substrate is segmented into functional regions with slits that create a buffer zone around the sensor mounting area. This segmentation provides stress isolation without requiring complex three-dimensional structures or additional components, as the regions are planar divisions on the substrate surface that can be implemented through standard manufacturing processes.
Solution Approach 2:
Different regions of the substrate are given different properties: the first region is optimized for sensor mounting with high dimensional stability, while the second and third regions with slits are designed to be more compliant and stress-absorbing. This local differentiation allows each region to perform its specific function optimally, enhancing suppression of accuracy decrease while maintaining overall structural simplicity.
Data Source
AI summary
An inertial sensor module includes a first inertial sensor that detects a physical quantity of a first axis, a second inertial sensor that detects the physical quantity of the first axis, a substrate includes a first region in which the first inertial sensor and the second inertial sensor are mounted, a second region surrounding the first region, and a plurality of slits provided between the first region and the second region to surround the first region.