Inertial Sensor Tilt Conversion for Weak Displacement Detection

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Solution Overview

Problem

Conventional MEMS and IC technologies face challenges in increasing performance, reducing size, and decreasing cost, particularly in applications requiring complex microsystems with greater computational power, and existing inertial sensors struggle to effectively detect weak displacements due to Coriolis forces.

Innovation Solution

A method for fabricating inertial sensing devices using tilt conversion, involving the formation of movable structures with flexible tilting members overlying a substrate and coupling them to frame structures connected to anchor structures, which converts pure tilting out-of-plane motion into pure translational motion, enabling detection of weak displacements through torsion or bending springs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional MEMS structures are used to detect inertial forces, then the device can sense motion, but the detection precision is insufficient for weak displacements due to Coriolis forces

Engineering Contradiction:
Improvedetection precisionVSAvoidreliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent converts out-of-plane tilting motion into in-plane translational motion through a mechanism involving a tilting member and a movable member. This dimensional transformation allows the use of in-plane sensing elements to detect out-of-plane inertial forces, significantly improving detection precision for weak Coriolis forces while maintaining structural reliability

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the device size is reduced to minimize package size, then manufacturing cost decreases, but detection capability for weak signals deteriorates

Engineering Contradiction:
Improvepackage sizeVSAvoiddetection capability
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

By transforming the sensing mechanism from out-of-plane to in-plane motion, the patent enables more efficient use of the available package volume. The in-plane translational motion allows for larger effective sensing area within the same footprint, improving detection capability without increasing package size

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent modifies the motion parameters by converting tilting motion to translational motion, which changes the displacement characteristics and allows for enhanced signal detection within compact dimensions. This parameter transformation improves the signal-to-noise ratio for weak Coriolis forces

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If flexible tilting members are added to convert motion, then detection precision improves, but device complexity increases

Engineering Contradiction:
Improvedetection precisionVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent integrates the tilting member and movable member into a unified structure where the tilting member is coupled to the movable member. This merging of functions reduces the number of discrete components while achieving the motion conversion, thereby improving detection precision without proportionally increasing device complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The tilting member serves multiple functions: it acts as both a mechanical element for motion conversion and a structural component that couples different parts of the device. This multi-functionality reduces the overall component count and simplifies the device architecture while maintaining enhanced detection capabilities

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances inertial sensor performance and reliability, reduces damping, and minimizes package size, while being compatible with conventional semiconductor fabrication technology, potentially leading to higher device yields and improved manufacturability.

Implementation Method 1

The movable structures can include flexible tilting members that can be deformed elastically

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

enabling detection of weak displacements through torsion or bending springs

Methodology Applied
Scientific EffectTorsion spring mechanism: Torsion Spring

Implementation Method 3

enabling detection of weak displacements through torsion or bending springs

Methodology Applied
Scientific EffectBending spring mechanism: Spring

Data Source

PatentUS8869616B1Method and structure of an inertial sensor using tilt conversion
Publication Date: 2014.10.28 MCUBE INC
  • US8869616B1 patent drawing
  • US8869616B1 patent drawing
  • US8869616B1 patent drawing

AI summary

A method and structure for fabricating an inertial sensing device using tilt conversion to sense a force in the out-of-plane direction. The method can include forming anchor structure(s) coupled to portions of a surface region of a substrate member. Also, the method can include forming flexible anchor members coupled to portions of the anchor structures and frame structures, which can be formed overlying the substrate. The method can also include forming flexible frame members coupled to portions of the frame structures and movable structures, which can also be formed overlying the substrate. Forming the movable structures can include forming peripheral and central movable structures, which can be coupled to flexible structure members. Peripheral movable structures having flexible tilting members can convert a pure tilting out-of-plane motion to a pure translational out-of-plane motion. The forming of these elements can include performing an etching process on a single silicon material.