Infield Test Controller Adapting Scan Toggling to Voltage Droop
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Solution Overview
Problem
Existing infield testing methods for integrated circuits (ICs) can cause high power dissipation and voltage droop during the capture phase, potentially leading to IC failure, especially in aged ICs.
Innovation Solution
The implementation of a deterministic testing method that monitors silicon health parameters such as voltage and temperature before executing infield tests, and adapts the testing schedule or degrades testing operations if critical parameters are not within safe ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If infield scan testing is executed with high toggling rate during capture phase, then testing effectiveness and defect detection capability are improved, but power dissipation increases causing voltage droop and potential IC failure
Solution Approach 1:
The patent dynamically adjusts the toggling rate of scan chains during infield testing based on real-time monitoring of voltage droop and temperature. The test controller modifies test parameters adaptively, reducing toggling rate when voltage droop exceeds thresholds to prevent IC failure, while maintaining higher rates when safe operating conditions exist, thus balancing defect detection effectiveness with power consumption control
Solution Approach 2:
The patent implements a feedback mechanism where voltage droop monitoring and temperature sensing continuously provide information to the test controller. Based on this feedback, the system adjusts test parameters in real-time, reducing test intensity when voltage droop or temperature exceeds safe thresholds, thereby preventing IC failure while maintaining testing effectiveness within safe operating boundaries
2Reliability
If infield testing is performed on aged ICs, then manufacturing compliance verification is achieved, but risk of IC failure increases due to high power dissipation and temperature rise
Solution Approach 1:
The patent performs preliminary monitoring of voltage droop and temperature conditions before executing infield tests on aged ICs. The system establishes safe operating thresholds and prepares adaptive test schedules in advance, adjusting test parameters proactively based on initial silicon health assessment to prevent IC failure during testing
Solution Approach 2:
The patent implements continuous feedback monitoring during infield testing of aged ICs, where voltage droop and temperature sensors provide real-time data to the test controller. The system adaptively adjusts test parameters based on this feedback, reducing test intensity when thresholds are approached, thereby verifying compliance while preventing catastrophic failure in aged silicon
3Measurement precision
If high toggling rate is applied during capture phase, then test coverage and defect detection are improved, but voltage droop and power leakage increase significantly
Solution Approach 1:
The patent dynamically controls the toggling rate of individual scan chains during capture phase based on real-time voltage droop monitoring. The test controller selectively adjusts or disables specific scan chains when voltage droop exceeds thresholds, maintaining test coverage in safe regions while reducing power leakage in problematic areas, thus balancing measurement precision with energy loss control
Data Source
AI summary
In one embodiment, an apparatus includes: a functional circuit to execute operations; test circuitry to execute infield testing of at least a portion of the functional circuit; a plurality of sensors to sense sensor information; and a test controller coupled to the test circuitry, the test controller to prevent at least a portion of the test circuitry from execution of the infield testing based at least in part on the sensor information. Other embodiments are described and claimed.