Inflatable Seal for Semiconductor Probe Station Housing

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Solution Overview

Problem

Existing semiconductor prober devices require complex and rigid mounting for pressure-tight connections, limiting flexibility and increasing energy demands for adjusting test atmospheres, especially under special conditions like elevated temperatures and nitrogen environments.

Innovation Solution

A prober design utilizing an inflatable seal made of elastic material that adapts to the shape of housing parts, eliminating the need for screw connections and allowing flexible configuration, enabling reduced housing volume and adaptable sealing to various pressures and temperatures, with positioning units that can be placed outside the housing for enhanced flexibility and reduced alignment demands.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If screw connections are used for pressure-tight connections between housing parts, then connection reliability is improved, but device complexity and rigidity increase

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmounting complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses an inflatable membrane seal that can be inflated with gas or liquid pressure to create a pressure-tight seal between housing parts. This pneumatic/hydraulic mechanism replaces traditional mechanical screw connections, providing reliable sealing while reducing structural complexity and enabling flexible positioning of components.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Reliability

If rigid mounting of housing parts is used, then pressure-tight connection is improved, but adaptability to different test conditions deteriorates

Engineering Contradiction:
Improvepressure-tight connectionVSAvoidflexibility for different tests
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The housing structure incorporates an inflatable membrane that can dynamically adjust its sealing pressure and configuration based on different test requirements. This dynamic element allows the same housing structure to adapt to various test conditions (different pressures, temperatures, atmospheres) while maintaining reliable pressure-tight connections.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If positioning units are placed inside the housing, then positioning precision is improved, but accessibility for maintenance deteriorates

Engineering Contradiction:
Improvepositioning precisionVSAvoidmaintenance accessibility
Core Design Contradiction:
Manufacturing precisionVSEase of repair

Solution Approach 1:

The inflatable membrane acts as a flexible barrier that can be temporarily deflated or reconfigured to provide access to positioning units located inside the housing. This allows maintenance personnel to reach and service internal components without compromising the overall positioning precision when the membrane is inflated for operation.

Inventive Principle:
Principle #30Flexible shells and thin films

4Use of energy by stationary object

If housing volume is reduced, then energy for atmosphere adjustment is improved, but space for positioning devices deteriorates

Engineering Contradiction:
Improveenergy for atmosphere adjustmentVSAvoidhousing volume
Core Design Contradiction:
Use of energy by stationary objectVSVolume of stationary object

Solution Approach 1:

The inflatable membrane sealing mechanism allows for a more compact housing design by eliminating the need for rigid flanged connections and large mounting surfaces. This reduced housing volume decreases the space required for atmosphere adjustment operations while the membrane provides sufficient sealing for the necessary positioning device clearance.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces time and energy required for adjusting test atmospheres, allows for flexible operation and maintenance, and supports a wide range of tests including overpressure, underpressure, high, and low temperatures, while maintaining precise positioning and minimizing housing volume.

Implementation Method 1

the seal remains deformable within limits that are definable by the shape of the seal and its first pressure stage

Methodology Applied
Scientific EffectDeformation: Deformation

Implementation Method 2

A prober design utilizing an inflatable seal made of elastic material that adapts to the shape of housing parts

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

the seal remains deformable within limits that are definable by the shape of the seal and its first pressure stage

Methodology Applied
Scientific EffectDeformation: Deformation

Data Source

PatentUS7579854B2Probe station and method for measurements of semiconductor devices under defined atmosphere
Publication Date: 2009.08.25 FORMFACTOR INC
  • US7579854B2 patent drawing
  • US7579854B2 patent drawing
  • US7579854B2 patent drawing

AI summary

A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.