InFO Package Structure With Integrated Heat Dissipation and Rigidity
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving efficient thermal dissipation and rigidity in integrated fan-out (InFO) packages, which are essential for maintaining optimal operating temperatures and preventing warpage, especially in compact designs where traditional thermal management solutions are inadequate.
Innovation Solution
The integration of a thermal dissipation structure with a substrate having excellent thermal properties, through-substrate vias, and a redistribution layer (RDL) connected to a die, along with a sequential encapsulation process, allows for effective heat dissipation and structural rigidity, enabling the formation of compact InFO packages that can maintain low operating temperatures without additional surface mount technology (SMT) processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional thermal management solutions are used in compact InFO packages, then the package size can be reduced, but thermal dissipation efficiency deteriorates and operating temperature increases
Solution Approach 1:
The patent combines the substrate and thermal dissipation structure into a single integrated component. The substrate itself is designed with thermal dissipation features, eliminating the need for separate thermal management components and enabling compact packaging while maintaining effective heat dissipation.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, enables electrical connections through through-substrate vias, and acts as a thermal dissipation structure. This multi-functionality allows the compact InFO package to achieve both small size and effective thermal management.
2Temperature
If additional SMT processes are added for thermal management, then thermal dissipation performance improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The thermal dissipation structure is merged with the substrate, allowing both components to be formed in the same manufacturing process. This eliminates the need for additional SMT processes to attach separate thermal management components, thereby reducing manufacturing complexity while maintaining thermal performance.
3Volume of moving object
If compact package design is implemented, then integration density improves, but structural rigidity deteriorates and warpage increases
Solution Approach 1:
The substrate is designed to simultaneously provide mechanical support for structural rigidity and serve as a thermal dissipation structure. Through-substrate vias are integrated into this multi-functional substrate, enabling compact packaging while maintaining both structural stability and thermal performance without compromising rigidity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides excellent thermal dissipation performance, maintains the package structure within suitable operating temperatures, and reduces warpage, while eliminating the need for additional SMT processes, thereby enhancing reliability and reducing costs.
Implementation Method 1
a thermal dissipation structure (20) disposed over the second surface of die and electrically connected to the die through the via and the redistribution layer
Data Source
AI summary
A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.