InFO Package Structure With Integrated Thermal Dissipation and Warpage Control

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Solution Overview

Problem

The semiconductor industry faces challenges in achieving efficient thermal dissipation and minimizing warpage in integrated fan-out (InFO) packages, which are critical for maintaining the performance and reliability of electronic components.

Innovation Solution

The integration of a thermal dissipation structure within the package structure, which includes a thermal dissipation shroud landing region, provides effective thermal management and rigidity, thereby addressing the issues of thermal dissipation and warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermal dissipation structure is integrated into the package, then thermal dissipation performance is improved, but device complexity increases

Engineering Contradiction:

Improvethermal dissipation performanceVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the thermal dissipation structure with the package substrate by integrating it into the same structural body. The thermal dissipation structure includes a first portion in physical contact with the first encapsulant and a second portion laterally protruding from the first encapsulant, merging thermal management functionality directly into the package structure rather than adding separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The package substrate serves multiple functions: it provides mechanical support for the semiconductor die, electrical interconnection through conductive layers, and thermal dissipation through the integrated thermal dissipation structure. This multi-functionality reduces the need for separate dedicated thermal management components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Stability of the object's composition

If the package structure is made more rigid to reduce warpage, then structural stability is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvewarpage resistanceVSAvoidpackage structure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The reinforcement structure is integrated into the package substrate as a unified component rather than being added as a separate element. The reinforcement structure includes a first portion within the first encapsulant and a second portion laterally protruding, merging structural reinforcement functionality directly into the substrate design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The package substrate employs a composite structure combining the substrate material with the reinforcement structure, creating a hybrid construction that provides enhanced mechanical properties. The reinforcement structure may use different materials or configurations to optimize both rigidity and manufacturability.

Inventive Principle:

Principle #40Composite materials

3Area of moving object

If the package size is reduced to achieve compactness, then space efficiency is improved, but thermal dissipation capability deteriorates

Engineering Contradiction:

Improvepackage areaVSAvoidthermal dissipation capability

Core Design Contradiction:

Area of moving objectVSTemperature

Solution Approach 1:

The thermal dissipation structure extends laterally protruding from the first encapsulant in a direction perpendicular to the main package plane. This three-dimensional configuration allows thermal dissipation functionality to be achieved within a compact footprint by utilizing vertical and lateral space efficiently rather than requiring extensive planar area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The thermal dissipation structure is nested within and integrated with the package substrate and encapsulant structure. The first portion is embedded within the first encapsulant while the second portion protrudes, creating a nested configuration that maximizes thermal management capability within the constrained package volume.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the thermal dissipation performance of InFO packages, maintains the die at a suitable operation temperature, and reduces warpage, thereby improving the reliability and performance of semiconductor components.

Implementation Method 1

a thermal dissipation structure disposed over the second surface of die and electrically connected to the die through the via and the redistribution layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12334434B2Package structure and method of forming the same

Publication Date: 2025.06.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.