Information Processing Device Cooling with Segmented Airflow Paths
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Solution Overview
Problem
Existing cooling mechanisms for information processing devices, such as those described in Japanese Laid-Open Patent Application Publication No. 2003-108269, restrict design freedom in surface mount technology and do not effectively discharge hot air from the CPU cooling fan, leading to increased CPU temperature and electrical current consumption.
Innovation Solution
The proposed solution involves an information processing device with a housing part, a heating part, a cooling unit, an airflow supplying member, and an airflow limitation member arranged in series, featuring an air intake and discharge system that includes a duct with a supplemental duct for efficient airflow management, allowing secure discharge of hot air without compromising design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a partition wall is used to separate high temperature and low temperature areas, then cooling effectiveness is improved, but design freedom of surface mount is lost
Solution Approach 1:
The cooling system is segmented into multiple independent airflow paths: one path for cooling the CPU (high temperature area) and another path for cooling the power control element (low temperature area). Each path has its own airflow supplying member and discharge opening, allowing independent optimization of each cooling zone without requiring physical partition walls that would constrain board layout freedom.
2Temperature
If CPU cooling fan is used to cool the CPU, then CPU temperature is reduced, but hot air discharge is not effectively addressed
Solution Approach 1:
The harmful hot air generated by the CPU cooling process is extracted and directed through a dedicated discharge path. The airflow limitation member creates a controlled flow that directs cool air to the CPU while the air discharge unit provides a separate exit path for hot air, effectively removing the harmful thermal accumulation from the device interior.
3Device complexity
If power control element is arranged near CPU, then wiring impedance is reduced, but thermal interference increases
Solution Approach 1:
Different local cooling qualities are provided to different components: the CPU receives high-velocity directed airflow from the CPU cooling fan through a dedicated path, while the power control element receives airflow from a separate path with its own airflow supplying member. This allows both components to be positioned close together for electrical connectivity while maintaining independent thermal management zones.
4Temperature
If multiple fans are used for cooling different areas, then cooling coverage is improved, but device complexity increases
Solution Approach 1:
The airflow limitation member serves multiple functions: it directs airflow to the CPU, creates pressure differential for flow control, and works with the air discharge unit to manage hot air extraction. The air discharge unit itself serves dual purposes by providing both a discharge path for hot air and a mounting structure for the airflow limitation member, reducing the need for separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools the heating parts, including the CPU and power control elements, while securely discharging hot air from the device, maintaining design flexibility and improving thermal management without increasing electrical current consumption.
Implementation Method 1
a cooling unit configured to cool the heating part
Implementation Method 2
an airflow supplying member configured to supply an airflow to the cooling unit
Data Source
AI summary
An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to supply an airflow to the cooling unit; and an airflow limitation member configured to limit the airflow supplied by the airflow supplying member. A part of the cooling unit, the airflow limitation member, and the airflow supplying member are arranged in series. An air intake part is provided in one surface of the housing part so as to intake air into the airflow limitation member. An air discharge part is provided in another surface of the housing part so as to discharge air cooling the part of the cooling unit. An air discharge unit is provided at an air discharge opening provided at one side surface of the airflow limitation member.