InFO Slot Antenna Package with Confinement Structure for Signal Loss
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating slot antennas at the package level, leading to signal radiation absorption by the silicon substrate, which results in signal loss and reduced device performance.
Innovation Solution
The integrated fan-out (InFO) package design incorporates a redistribution structure, conductive structures, an encapsulant, a second redistribution structure, an insulating layer, and a slot antenna, where the slot antenna is integrated at the package level with an antenna confinement structure to enhance signal gain and reduce signal loss, using a manufacturing process that includes forming dielectric layers, conductive vias, and plating processes to create a resonant cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If slot antenna is integrated at the package level, then signal gain is enhanced and radiation beam width is narrowed, but signal radiation absorption by the silicon substrate occurs resulting in signal loss
Solution Approach 1:
An antenna confinement structure is introduced as an intermediary between the slot antenna and the silicon substrate. This structure prevents direct signal radiation into the substrate by providing a confining boundary, thereby reducing signal absorption while maintaining the antenna's radiation capability in the desired direction.
Solution Approach 2:
The antenna confinement structure creates a localized electromagnetic environment around the slot antenna. By modifying the local structural properties (adding sidewalls and封顶结构), the patent confines the electromagnetic field distribution, directing radiation away from the substrate while enhancing gain in specific directions.
2Loss of energy
If antenna confinement structure is added to reduce signal absorption, then signal loss is reduced, but device complexity increases
Solution Approach 1:
The antenna confinement structure is merged with the existing package substrate structure. The confinement structure utilizes the package substrate as its base, and the sidewalls are integrated with the packaging process flows, combining multiple functions into a unified structure rather than adding completely separate components.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the semiconductor die, enables electrical connections through conductive vias, and forms the basis of the antenna confinement structure. This multi-functionality reduces the need for additional dedicated structures, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances device performance by reducing signal loss and achieving a narrower radiation beam width, suitable for terahertz operations, and effectively addresses the issue of signal absorption by the silicon substrate, improving overall package efficiency.
Implementation Method 1
creating a resonant cavity
Data Source
AI summary
An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.