InFO Package Support Die Structure for Warpage Control
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Solution Overview
Problem
Conventional semiconductor packaging technologies face challenges in integrating a high number of I/O pads due to limited pitch and warpage issues, leading to solder bridges and failed solder joins, particularly in fan-out packages.
Innovation Solution
The integration of a dummy support die with high thermal conductivity and rigidity is used to mechanically support the package, reducing warpage and improving thermal dissipation, while allowing for increased I/O pad density through redistribution lines and bridge die interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If fan-out packages are used to increase I/O pad density, then the number of I/O pads can be increased, but warpage occurs causing bonding difficulty and solder join failure
Solution Approach 1:
A support die is introduced as an intermediary component between the package and the bonding substrate. The support die has a larger area than the package, providing mechanical support and reducing warpage. This intermediary structure enables reliable solder joins while maintaining high I/O pad density through redistribution lines.
Solution Approach 2:
The patent changes the physical parameters of the packaging structure by introducing a support die with specific properties (larger area, appropriate thickness) to alter the mechanical behavior of the package. This parameter change reduces warpage and enables successful bonding while maintaining high I/O pad density.
2Quantity of substance
If I/O pad pitch is decreased to increase pad density, then more I/O pads can be integrated, but solder bridges occur
Solution Approach 1:
The patent uses redistribution lines to relocate I/O pads from a dense arrangement directly over the die to a more spread-out arrangement on the support die. This dimensional redistribution allows pads to be closer together without causing solder bridges, as the support structure provides mechanical stability and the pads can be optimally positioned.
3Productivity
If conventional packaging is used before wafer sawing, then throughput is greater and cost is lower, but I/O pad number is limited due to pitch constraints
Solution Approach 1:
The support die is prepared in advance with appropriate mechanical properties and larger area before the packaging process. This preliminary preparation enables the subsequent packaging to achieve both high throughput and high I/O pad density without the limitations of conventional approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances package stability and thermal management, reducing warpage and improving yield by allowing for more efficient integration of I/O pads without solder bridges or failed joins.
Implementation Method 1
dummy support die with high thermal conductivity and rigidity is used to mechanically support the package, reducing warpage and improving thermal dissipation
Implementation Method 2
dummy support die with high thermal conductivity and rigidity is used to mechanically support the package, reducing warpage
Data Source
AI summary
A method includes encapsulating a first device die and a second device die in an encapsulating material, forming redistribution lines over and electrically coupling to the first device die and the second device die, and bonding a bridge die over the redistribution lines to form a package, with the package including the first device die, the second device die, and the bridge die. The bridge die electrically inter-couples the first device die and the second device die. The first device die, the second device die, and the bridge die are supported with a dummy support die.