InFO Package Testing Metal Line for Delamination Detection
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Solution Overview
Problem
The semiconductor industry faces manufacturing challenges such as poor adhesion between the die and carriers, warpage, die shifting, and reliability issues like delamination and moisture pollution in three-dimensional (3D) ICs and wafer level packaging due to insufficient bonding between the device dies and molding material.
Innovation Solution
The implementation of an Integrated Fan-Out (InFO) package structure with through-vias, which includes forming a carrier with an adhesive layer, a buffer layer, and a seed layer, followed by metal features and device dies, and using a testing pad to detect delamination by applying a current and assessing the electrical signal, ensuring proper bonding and reducing stress on redistribution lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If three-dimensional (3D) ICs and wafer level packaging are used to increase circuit density, then integration density is improved, but adhesion between die and carriers deteriorates leading to delamination
Solution Approach 1:
The patent applies preliminary action by forming a testing metal line structure before final packaging completion. This allows delamination detection to be performed early in the manufacturing process, enabling preventive measures to be taken before the delamination worsens and affects product reliability. The testing structure is integrated into the package during manufacturing, allowing for proactive quality assurance.
2Reliability
If bonding between device dies and molding material is increased to prevent delamination, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent introduces an intermediary testing metal line structure that acts as a mediator between the package components and the delamination defect. This testing structure provides a dedicated pathway for detecting delamination without requiring modification of the existing bonding interfaces. The intermediary testing structure simplifies the overall approach by separating the detection function from the bonding function, allowing each to be optimized independently.
3Reliability
If testing methods are applied to detect delamination, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The testing metal line structure is designed to be self-forming through standard packaging processes. The metal line utilizes existing molding material and package structures, automatically creating the testing pathway without requiring additional precise manufacturing steps. The structure leverages the package's own geometry and materials to establish the testing configuration, reducing the burden on manufacturing precision while maintaining effective delamination detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding reliability, reduces delamination, and improves the overall structural integrity of the package by isolating redistribution lines from delamination stress, thereby addressing the manufacturing challenges in 3D ICs and wafer level packaging.
Implementation Method 1
applying a current to the testing metal line; detecting an electrical signal of the testing metal line during the applying the current to the testing metal line
Data Source
AI summary
A method of detecting delamination in an integrated circuit package structure, the method includes forming a plurality of through vias over a carrier substrate; placing a device die over the carrier substrate and between the through vias, wherein the device die comprises a metal pillar; forming a molding material surrounding the device die and the through vias; forming a testing metal line extending along a top surface of the molding material and past an interface between the device die and the molding material; applying a current to the testing metal line; detecting an electrical signal of the testing metal line during the applying the current to the testing metal line; and determining, based on the detected electrical signal of the testing metal line, whether a delamination occurs between the device die and the molding material.