Infrared Absorptive Metal Layer for Electronic Component Packaging
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Solution Overview
Problem
The low infrared absorptivity of insulating substrates made of aluminum oxide sintered bodies hinders efficient heat transmission during the joining process of electronic component housing packages, leading to increased time and reduced hermeticity due to incomplete melting of brazing materials.
Innovation Solution
Incorporating a second metal oxide with higher infrared absorptivity into the first metal layer on the substrate's surface allows for enhanced heat transmission to the brazing material, reducing the joining time and ensuring complete melting, thereby improving the hermeticity of the electronic component housing space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If infrared heating is used to join the lid body to the insulating substrate, then the joining operation can be performed efficiently, but the low infrared absorptivity of the insulating substrate causes insufficient heat transmission to the brazing material
Solution Approach 1:
A metal layer with high infrared absorptivity is introduced as an intermediary between the insulating substrate and the brazing material. This metal layer absorbs infrared radiation effectively and transmits the heat to the brazing material, resolving the heat transmission insufficiency caused by the low infrared absorptivity of the insulating substrate while maintaining efficient joining operation
Solution Approach 2:
The infrared absorptivity parameter of the substrate surface is changed by adding a metal layer with high infrared absorptivity. This parameter change enables effective heat absorption from infrared radiation and subsequent heat transmission to the brazing material, ensuring complete melting and proper hermeticity while maintaining efficient joining operation
2Strength
If the insulating substrate made of aluminum oxide sintered body is used, then good electrical insulation and mechanical strength are achieved, but infrared absorptivity remains low leading to time-consuming heating
Solution Approach 1:
A composite structure is created by combining the insulating substrate (aluminum oxide sintered body) with a metal layer having high infrared absorptivity. The insulating substrate maintains its excellent electrical insulation and mechanical strength properties, while the metal layer layer adds high infrared absorptivity to reduce heating time for the brazing material
3Device complexity
If conventional infrared heating method is used, then heating process is simple, but heat cannot be transmitted sufficiently to some part of the brazing material causing incomplete melting
Solution Approach 1:
The metal layer acts as a heat distribution intermediary that receives infrared radiation and distributes the heat uniformly across the brazing material area. This ensures sufficient heat transmission to all parts of the brazing material for complete and uniform melting, while the heating process itself remains relatively simple
Solution Approach 2:
The metal layer promotes homogeneous heat distribution across the brazing material by absorbing infrared radiation uniformly and conducting heat evenly to all areas. This eliminates the non-uniform melting problem where some parts of the brazing material fail to reach the melting point
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a second metal oxide with higher infrared absorptivity in the first metal layer accelerates the brazing process, ensuring successful joining and enhancing the hermetic sealing of the electronic component housing space.
Implementation Method 1
the first metal layer in frame-like form disposed on the upper surface of the uppermost one of the plurality of insulating layers contains the second metal oxide which is higher in infrared absorptivity than the first metal oxide
Implementation Method 2
Applied infrared rays are absorbed by the insulating substrate while being converted into heat energy
Implementation Method 3
heat generated in the first metal layer having relatively high infrared absorptivity can be transmitted directly to the brazing material
Implementation Method 4
the brazing material fails in part to reach a melting point thereof. After all, the brazing material is not melted thoroughly
Implementation Method 5
the joining of the lid body and the insulating substrate is effected by joining the metal-made lid body to a metal layer disposed at an outer periphery of the upper surface of the insulating substrate via a brazing material
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package (10) includes an insulating substrate (1) including a plurality of insulating layers (11) stacked on top of each other, an upper surface of the insulating substrate (1) being provided with an electronic component (4) mounting section. The plurality of insulating layers (11) each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer (2) in frame-like form disposed on an upper surface of an uppermost one (11) of the plurality of insulating layers (11). The first metal layer (2) contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.