Infrared Camera Substrate Temperature Uniformity Control
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Solution Overview
Problem
Conventional semiconductor processing systems face challenges in achieving uniform temperature profiles across substrates due to limited point measurements from individual sensors, which are insufficient for real-time monitoring and control, especially in high-temperature processes like RTP and CVD epitaxial reactors.
Innovation Solution
An apparatus and method utilizing an infrared camera to measure temperature profiles across the substrate surface, coupled with a system controller that adjusts heating element power and substrate rotation to maintain uniformity, allowing for real-time temperature monitoring and control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If individual temperature sensors (pyrometers) are used for point measurement, then the device complexity is reduced, but the measurement precision and coverage of temperature profile across the substrate is insufficient
Solution Approach 1:
The patent uses an infrared camera to capture thermal radiation images of the substrate surface, creating a visual copy of the temperature distribution. This allows full-field temperature profiling without requiring multiple physical contact sensors across the substrate surface, thus improving measurement precision while avoiding the complexity of deploying numerous individual sensors.
Solution Approach 2:
The patent replaces mechanical contact temperature sensors with an optical-based infrared detection system. The infrared camera detects thermal radiation emitted by the substrate surface, converting thermal energy directly into visual temperature maps without mechanical contact, thereby achieving comprehensive temperature measurement without the structural complexity of multiple sensor arrays.
2Measurement precision
If a large number of sensors are deployed to accurately measure the entire substrate temperature profile, then the measurement precision improves, but the device complexity and cost increase prohibitively
Solution Approach 1:
The infrared camera serves multiple functions simultaneously: it provides full-field temperature mapping, real-time thermal monitoring, and spatial temperature distribution analysis. This single device replaces what would otherwise require numerous individual temperature sensors positioned at different locations, achieving comprehensive measurement precision without proportional increases in device complexity.
Solution Approach 2:
The patent transitions from one-dimensional point measurements by individual sensors to two-dimensional full-field temperature mapping using an infrared camera. This dimensional transformation allows simultaneous measurement of temperature across the entire substrate surface, achieving complete temperature profile precision with a single imaging device rather than multiple point sensors.
3Manufacturing precision
If heating elements are controlled based on limited point measurements, then the device complexity is reduced, but the manufacturing precision of uniform temperature profile deteriorates
Solution Approach 1:
The patent implements a feedback control system where the infrared camera continuously monitors the substrate surface temperature distribution, and the control system adjusts individual heating element power based on the detected temperature non-uniformities. This closed-loop feedback enables precise temperature uniformity control by dynamically compensating for thermal variations across different substrate regions.
Solution Approach 2:
The patent applies local quality control by independently adjusting the power output of individual heating elements based on spatially-resolved temperature measurements from the infrared camera. Each heating element can be tuned to provide localized heating or cooling, enabling precise temperature uniformity across the substrate surface by addressing specific thermal non-uniformities in different regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides detailed and high-resolution temperature data, enabling precise real-time adjustments to minimize temperature non-uniformity across the substrate, improving processing accuracy and efficiency in semiconductor manufacturing.
Implementation Method 1
a temperature sensor assembly that is configured to measure a temperature profile of the region of the surface of the substrate, wherein the temperature sensor assembly comprises an infrared camera
Implementation Method 2
a heat source having a plurality of heating elements that are configured to transfer an amount energy to a region of a surface of the substrate that is disposed on the substrate support
Data Source
AI summary
Embodiments of the invention generally contemplate an apparatus and method for monitoring and controlling the temperature of a substrate during processing. One embodiment of the apparatus and method takes advantage of an infrared camera to obtain the temperature profile of multiple regions or the entire surface of the substrate and a system controller to calculate and coordinate in real time an optimized strategy for reducing any possible temperature non-uniformity found on the substrate during processing.