Infrared Scene Projector Conversion Chip Thermal Isolation

The substrate is segmented into isolated mounting regions for each conversion unit, with thermal barrier structures (such as air gaps or low-thermal-conductivity materials) separating adjacent units. This segmentation prevents heat conduction between neighboring conversion units while maintaining structural support, thus achieving thermal insulation without significantly increasing device complexity.

The thermal isolation structure is designed with non-uniform thermal conductivity: the regions directly beneath each conversion unit have high thermal isolation (low thermal conductivity) to ensure independent infrared radiation emission, while the peripheral support structures maintain adequate thermal pathways for heat dissipation. This local quality differentiation achieves independent emission while controlling response time through optimized heat dissipation paths.

A dual-layer thermal management structure is introduced: a first thermal management layer between each suspended platform and the substrate provides localized thermal isolation for independent emission, while a second thermal management layer at the substrate level provides thermal pathways for heat dissipation. This intermediary layered structure simultaneously achieves thermal insulation between adjacent units and adequate response time through controlled heat dissipation.