Infrared Cut Filter Pattern-Forming Composition
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Solution Overview
Problem
Infrared cut filters used in imaging devices face challenges with heat resistance and pattern formability, where infrared absorbing colorants have low heat resistance and materials with high heat resistance have poor pattern formability, leading to insufficient development residue suppressing properties.
Innovation Solution
A pattern-forming composition comprising an infrared absorbing colorant and a resin or precursor with a glass transition temperature of 150° C to 300° C, which includes squarylium, cyanine, or phthalocyanine compounds, and a polymerizable compound with a photopolymerization initiator, to form a film with improved heat resistance and pattern formability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an infrared absorbing colorant is used in an infrared cut filter, then infrared absorption capacity is improved, but heat resistance deteriorates due to thermal decomposition
Solution Approach 1:
The patent changes the glass transition temperature parameter of the resin from conventional low values to specifically 150°C to 300°C, which fundamentally alters the thermal stability characteristics of the cured film, enabling it to maintain infrared absorption capacity while achieving high heat resistance
Solution Approach 2:
The patent creates a composite material system combining infrared absorbing colorants with specific high Tg resins or their precursors, where the resin matrix provides thermal stability and protects the colorant from decomposition, while the colorant maintains its infrared absorption function
2Reliability
If a cured film with high heat resistance is used, then heat resistance is improved, but pattern formability deteriorates due to poor shape retention and development residue
Solution Approach 1:
The patent optimizes the glass transition temperature parameter to a specific range (150°C to 300°C) that balances thermal stability and pattern formability, and controls the molecular weight of the resin within 1,000 to 100,000 to achieve both heat resistance and good development properties
Solution Approach 2:
The patent applies different functional requirements to different aspects of the material: high glass transition temperature for heat resistance, controlled molecular weight for pattern formability, and specific functional groups for both adhesion and development characteristics
3Ease of manufacture
If conventional resins are used in pattern-forming composition, then ease of manufacture is improved, but development residue suppressing properties deteriorate
Solution Approach 1:
The patent changes the molecular weight parameter of the resin to a specific range (1,000 to 100,000) and introduces specific functional groups (carboxy, phenolic hydroxy, sulfonamide, or their protected forms), which fundamentally improves development residue suppressing properties while maintaining ease of manufacture
Solution Approach 2:
The patent uses acid-decomposable protecting groups as intermediaries that are removed during development to suppress residue formation, while the underlying functional groups provide the necessary adhesion and development characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent development residue suppressing properties, enabling patterns with good shape retention and heat resistance, suitable for infrared cut filters, solid image pickup elements, and camera modules.
Implementation Method 1
a polymerizable compound and a photopolymerization initiator
Data Source
AI summary
Provided is a pattern-forming composition, including: an infrared absorbing colorant; and at least one compound selected from the group consisting of a resin having a glass transition temperature of 150° C. to 300° C. and a precursor of a resin having a glass transition temperature of 150° C. to 300° C.