Infrared Ray Detector With Controllable Gap For Thermal Isolation
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Solution Overview
Problem
Current infrared ray detectors face challenges in achieving high resolution and temperature precision due to reduced pixel size, which increases thermal conductivity and noise, limiting pixel size by the diffraction limit of the wavelength.
Innovation Solution
The infrared ray detector incorporates a second metal layer that absorbs infrared rays through localized surface plasmon resonance (LSPR), a thermistor layer with resistance changes, and a thermal leg with controlled gap to enhance temperature change detection, allowing for a smaller pixel size while maintaining detection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pixel size is reduced to achieve high resolution, then resolution is improved, but thermal conductivity increases and temperature change decreases
Solution Approach 1:
The patent introduces a controllable gap parameter between the first metal layer and thermal leg that can be adjusted to optimize thermal conductivity. By changing this gap parameter, the system achieves high resolution with maintained temperature change detection capability, resolving the contradiction between pixel size reduction and thermal conductivity increase.
Solution Approach 2:
The patent introduces an intermediary structure (the gap between first metal layer and thermal leg) that mediates the thermal conduction path. This intermediary element allows control over thermal conductivity while maintaining the compact pixel structure, enabling high resolution without excessive thermal conduction that would reduce temperature change.
2Measurement precision
If pixel size is reduced to achieve high resolution, then resolution is improved, but thermal noise increases
Solution Approach 1:
The controllable gap parameter serves as a key variable that can be optimized to reduce thermal noise. By adjusting this parameter, the system maintains high resolution while suppressing thermal conduction that would otherwise increase noise, thereby improving reliability.
Solution Approach 2:
The gap structure acts as an intermediary that selectively blocks thermal noise pathways while preserving the optical detection function. This mediator element enables high resolution imaging with reduced thermal noise interference.
3Temperature
If gap between first metal layer and thermal leg is controlled to reduce thermal conductivity, then temperature change increases, but device complexity increases
Solution Approach 1:
The patent implements temperature change enhancement through a relatively simple parameter change (gap control) rather than complex structural modifications. This approach achieves the desired thermal isolation with minimal added complexity to the overall device architecture.
Solution Approach 2:
The gap intermediary structure provides an efficient way to control thermal conductivity without requiring complex additional components. This simple intermediary element achieves thermal isolation while keeping device complexity low.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a smaller pixel size with increased temperature change and reduced thermal conductivity, achieving higher resolution and precision in thermal imaging while compensating for external factors to produce accurate thermal images.
Implementation Method 1
the second metal layer may have a patterned shape to absorb infrared rays by generating a localized surface plasmon resonance (LSPR)
Implementation Method 2
a thermistor layer supporting the second metal layer and having a resistance that is changed by infrared rays absorbed in the second metal layer
Implementation Method 3
a thermal leg supporting the thermistor layer and separated from the first metal layer
Data Source
AI summary
A infrared ray detector includes a first metal layer; a second metal layer on the first metal layer and configured to absorb infrared rays; a thermistor layer below the second metal layer, the thermistor layer having a resistance that changes according to infrared rays absorbed in the second metal layer; a thermal leg below the thermistor layer and separated from the first metal layer; and a control unit configured to control a gap between the first metal layer and the thermal leg.


