Infrared Detector Carrier Membrane with Segmented Hole Tracks
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Solution Overview
Problem
Infrared light detectors face challenges in achieving high resolution and high structural density due to thermal crosstalk between sensor chips, which is typically addressed by increasing the distance between them, resulting in a larger detector area.
Innovation Solution
The use of a carrier membrane with parallel hole tracks that hinder thermal conduction between sensor chips, combined with thermal conductor strips and ribs for efficient heat dissipation, reduces thermal crosstalk and allows for a higher population density of sensor chips while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between sensor chips is increased to reduce thermal crosstalk, then thermal crosstalk is reduced, but the areal extent of the infrared light detector becomes too large
Solution Approach 1:
The carrier membrane is segmented by introducing hole tracks that divide the thermal conduction path between sensor chips. These hole tracks create thermal isolation zones that segment the heat flow, reducing thermal crosstalk without requiring increased distance between sensor chips.
Solution Approach 2:
The carrier membrane is given non-uniform thermal conductivity through the selective removal of material in hole track regions. This creates local thermal insulation zones with reduced thermal conductivity, allowing heat to be isolated between adjacent sensor chip regions while maintaining structural integrity.
2Area of stationary object
If sensor chips are arranged with high population density to reduce detector area, then areal extent is reduced, but thermal crosstalk between sensor chips increases
Solution Approach 1:
Hole tracks are introduced to segment the thermal conduction paths between closely spaced sensor chips. This segmentation allows high population density arrangement while maintaining thermal isolation between adjacent sensors through the interrupted heat flow paths created by the hole tracks.
Solution Approach 2:
The hole tracks act as intermediary thermal barriers between adjacent sensor chips. These regions of removed material serve as thermal mediators that block and redirect heat flow, preventing direct thermal coupling between closely spaced sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the spatial resolution and response time of the infrared light detector by minimizing heat transfer between sensor chips, allowing for quicker heating and cooling, and maintaining structural integrity and strength.
Implementation Method 1
the sensor chip is heated due to absorption of the infrared light by the sensor chip
Implementation Method 2
The heat is transferred from the sensor chip to the carrier membrane via thermal conduction
Implementation Method 3
the thermal conduction from the one sensor chip to the other sensor chip is hindered by the hole tracks
Data Source
AI summary
An infrared light detector has a carrier membrane with at least two sensor chips thereon located next to each other. The carrier membrane has at least two rows of holes therein, proceeding parallel to each other between the sensor chips. The respective holes in one of the rows are offset with respect to the holes in an adjacent row, thereby hindering heat transmission via the carrier membrane between the sensor chips.