Surface Mounted Infrared Detector PCB Integration
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Solution Overview
Problem
Infrared image detector systems in vacuum-sealed packages are incompatible with traditional surface mount technology, leading to unreliable and costly connections using fragile ribbon connectors.
Innovation Solution
Mounting an infrared image detector system on a printed circuit board (PCB) using surface mount technology, with a semiconductor die having an infrared detector array and connection points on one surface and a heat sink on the opposing surface, allowing for electrical coupling and positioning of the detector array through a window in the PCB to receive infrared radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum-sealed packaging is used for infrared image detectors, then the detector can operate in a controlled environment, but surface mount technology becomes incompatible and connection reliability deteriorates
Solution Approach 1:
The patent inverts the traditional mounting approach by mounting the infrared detector array on the rear surface of the PCB rather than the front surface. This inversion allows the detector to be vacuum-sealed while maintaining compatibility with PCB mounting techniques, as the connection points are accessible on the rear surface where they can be reliably connected without requiring the detector to be mounted in a conventional surface mount configuration.
Solution Approach 2:
The patent transitions from conventional two-dimensional surface mounting to a three-dimensional arrangement by positioning the detector array on the rear surface of the PCB and routing connection points through the board thickness. This dimensional change enables vacuum sealing while maintaining electrical connectivity, as the connection path extends through the third dimension (board thickness) rather than relying solely on surface connections.
2Reliability
If ribbon connectors are used to connect infrared detectors to PCB, then electrical connection can be achieved, but the system becomes vulnerable to damage from excessive flexing and becomes cumbersome
Solution Approach 1:
The patent merges the electrical connection function directly into the PCB structure by integrating connection points and conductive traces within the board itself. This eliminates the need for separate ribbon connectors, as the PCB serves both as the structural support and the electrical interconnection medium, thereby improving durability while reducing system complexity.
Solution Approach 2:
The PCB acts as an intermediary element that directly connects the infrared detector array to the electronic circuitry. By using the PCB as the intermediate connection medium rather than separate ribbon connectors, the system achieves more reliable connections that are integrated into the board structure and less susceptible to flexing damage.
3Ease of manufacture
If infrared detector array is mounted on PCB using surface mount technology, then manufacturing cost is reduced and ease of manufacture is improved, but traditional vacuum packaging requirements must be abandoned
Solution Approach 1:
The patent inverts the traditional packaging sequence by first mounting the detector array on the PCB using cost-effective surface mount techniques, then applying vacuum sealing to the entire assembled unit. This inversion allows manufacturers to use inexpensive PCB mounting methods while still achieving the protective vacuum environment, as the sealing is applied after assembly rather than requiring pre-vacuum packaging.
Solution Approach 2:
The PCB serves multiple functions: it provides mechanical support for the detector array, establishes electrical connections through integrated traces, and serves as part of the vacuum seal structure. This multi-functionality allows the PCB to fulfill both manufacturing ease requirements and vacuum integrity requirements, eliminating the need for separate vacuum packaging components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a more reliable and cost-effective infrared image detector system that is less prone to damage and easier to manufacture and maintain, eliminating the need for cumbersome ribbon connectors.
Implementation Method 1
a heat sink can be coupled to an opposing second surface of the semiconductor die
Implementation Method 2
infrared radiation incident on the second side of the PCB will reach the infrared image detector array through the window
Data Source
AI summary
An infrared image detector system mounted on a printed circuit board (PCB) is disclosed for use with an infrared imaging system such as an infrared camera. A semiconductor die having an infrared detector array and connection points on a first surface is mounted to a PCB and electrically coupled to electrical connection points on a PCB. In addition, a heat sink can be coupled to an opposing second surface of the semiconductor die. Still further, the PCB can have a window within which the infrared image detector array can be positioned so that the infrared image detector system can be mounted to one side of the PCB while infrared radiation incident on the second side of the PCB will reach the infrared image detector array through the window.