Infrared Detector Pixel Array With Multi-Height Connection Electrodes

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Solution Overview

Problem

Existing two-wavelength infrared sensors face challenges in miniaturization due to complex manufacturing processes and increased pixel size, making it difficult to achieve compact and high-definition infrared image sensors.

Innovation Solution

The infrared detector employs an array of pixels sensitive to different wavelengths, where each pixel has a single connection electrode, and interpolation processing is used to determine the output signals for both wavelengths from surrounding pixels, allowing for reduced pixel size and maintained detection precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple connection electrodes are used per pixel for multi-wavelength detection, then detection capability is improved, but pixel size and manufacturing complexity increase

Engineering Contradiction:
Improvemulti-wavelength detection capabilityVSAvoidpixel structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The pixel array is segmented into different wavelength response regions, with each pixel optimized for specific wavelength bands. The connection electrodes are also segmented into different height levels (first, second, and third connection electrodes at different heights) to connect to different wavelength detection regions, allowing multi-wavelength detection while maintaining simpler individual pixel structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a vertical dimension to the connection electrode structure by using electrodes at different heights (multiple layers) to connect to different wavelength detection regions. This three-dimensional electrode arrangement allows multi-wavelength detection capability without increasing the horizontal pixel size, effectively adding a vertical dimension to resolve the contradiction between detection capability and pixel size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple connection electrodes per pixel are used, then multi-wavelength detection is enabled, but manufacturing process complexity increases

Engineering Contradiction:
Improvewavelength detection rangeVSAvoidmanufacturing process simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The manufacturing process is segmented into sequential steps for forming connection electrodes at different heights. First connection electrodes are formed to connect to first wavelength detection regions, then second connection electrodes at different heights are formed to connect to second wavelength detection regions, and finally third connection electrodes are formed to connect to third wavelength detection regions. This segmented approach enables multi-wavelength detection while making the manufacturing process more manageable through step-by-step fabrication.

Inventive Principle:
Principle #1Segmentation

3Area of moving object

If pixel size is reduced for miniaturization, then array density increases, but maintaining multi-wavelength detection capability becomes difficult

Engineering Contradiction:
Improvepixel pitchVSAvoidmulti-wavelength detection function
Core Design Contradiction:
Area of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent uses vertical stacking of connection electrodes at different heights to achieve multi-wavelength detection within a compact horizontal footprint. By utilizing the vertical dimension (different electrode heights) rather than expanding horizontally, the pixel pitch can be reduced while maintaining the multi-wavelength detection function through the three-dimensional electrode-detection region connection structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Productivity

If more elements are packed in array area, then resolution increases, but connection electrode layout complexity increases

Engineering Contradiction:
Improveelement densityVSAvoidelectrode arrangement complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The connection electrodes are segmented into different height groups (first, second, and third connection electrodes at different heights) that connect to different wavelength detection regions. This segmentation allows for systematic electrode layout planning where each height level can be independently arranged to connect to its corresponding detection region, simplifying the overall electrode arrangement process while achieving high element density.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables the creation of a compact, high-definition infrared detector that maintains detection precision by interpolating output signals from surrounding pixels, reducing pixel size and increasing the number of elements in a given array area.

Implementation Method 1

an infrared detection element array 20 that includes an array of a plurality of pixels... a first pixel and a second pixel are repeatedly arranged in a predetermined arrangement pattern, the first pixel being a pixel configured to respond to infrared light of a first wavelength, the second pixel being a pixel configured to respond to a second wavelength different from the first wavelength

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS11070748B2Infrared detector, infrared imaging apparatus using the same, and controlling method of infrared detector
Publication Date: 2021.07.20 FUJITSU LTD
  • US11070748B2 patent drawing
  • US11070748B2 patent drawing
  • US11070748B2 patent drawing

AI summary

An apparatus for infrared detection includes: an infrared detection element array that includes an array of a plurality of pixels, the array of the plurality of pixels being configured such that a first pixel and a second pixel are repeatedly arranged in a predetermined arrangement pattern, the first pixel being a pixel configured to respond to infrared light of a first wavelength, the second pixel being a pixel configured to respond to a second wavelength different from the first wavelength; and a readout circuit configured to be coupled to the infrared detection element array, wherein the first pixel is configured to be coupled to the readout circuit via a first connection electrode, and wherein the second pixel is configured to be coupled to the readout circuit via a second connection electrode, the second connection electrode being an electrode having a height different from that of the first connection electrode.