Infrared Detector Solder Paste Alignment
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Solution Overview
Problem
Conventional infrared light detectors have low component density and measurement accuracy due to the presence of through holes in the printed circuit board, which limits the space for sensor chips and requires complex manufacturing processes to achieve parallelism between the circuit board and housing components.
Innovation Solution
A method that eliminates through holes on the printed circuit board, allowing for a higher density of sensor chips and electronic circuits by using solder paste connections between the circuit board and connection pins, which are held in place by through-fittings in the housing base, ensuring precise parallelism and high measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If through holes are provided in the printed circuit board for connecting pins, then electrical connection between terminal pins and circuit board is achieved, but the space available for sensor chips and circuitry is reduced, resulting in low component density
Solution Approach 1:
The invention extracts the through holes from the printed circuit board structure, eliminating them entirely. Instead, connection pins are directly mounted on the surface of the circuit board, and electrical connection is achieved through solder paste applied to the pins, which are then soldered to corresponding pads on the circuit board. This extraction of the through hole feature resolves the contradiction by freeing up board space for higher component density while maintaining the necessary electrical connections.
2Measurement precision
If sensor chips are arranged on the printed circuit board and infrared light filter is integrated in the housing cover, then the detector structure is formed, but complex measures are required to ensure sufficient parallelism between the circuit board and housing cover for high measurement accuracy
Solution Approach 1:
The invention introduces a parallelism assurance mechanism as an intermediary element in the manufacturing process. This mechanism includes providing the printed circuit board with predetermined parallelism to the housing base, and using this pre-established parallelism relationship as a reference for positioning the sensor chips and infrared light filter. By having the circuit board itself serve as the parallelism reference rather than requiring complex adjustment mechanisms, the invention achieves high measurement accuracy while reducing manufacturing complexity.
3Volume of moving object
If conventional manufacturing methods are used with through holes and complex parallelism measures, then electrical connections are established, but the geometric dimensions of the infrared light detector are larger than necessary
Solution Approach 1:
The invention extracts and eliminates the through holes from the circuit board structure, allowing terminal pins to be positioned directly on the surface without requiring holes to pass through the board. This enables more efficient use of the circuit board area, allowing sensor chips and electronic circuits to be arranged more densely. The result is a compact infrared light detector with reduced geometric dimensions while maintaining manufacturing simplicity through the use of surface-mounted connection pins and solder paste connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a compact infrared light detector with high structural density and measurement accuracy, as the entire circuit board surface is available for sensor chips and electronic circuits, and the precise positioning of connection pins ensures high parallelism between sensor chips and their associated infrared light filters.
Implementation Method 1
The liquefying of the solder paste bodies is preferably accomplished by heating the solder paste bodies and the solidification of the solder paste bodies by cooling the solder paste bodies.
Implementation Method 2
The liquefying of the solder paste bodies is preferably accomplished by heating the solder paste bodies and the solidification of the solder paste bodies by cooling the solder paste bodies.
Data Source
Figure 1~2
Figure 3
AI summary
A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on account of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.