Infrared Light Cut Filter Protection Against Dye Elution

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Solution Overview

Problem

Existing methods for producing infrared light cut filters in solid-state imaging devices face issues with the elution of infrared light absorbing dyes due to contact with stripping solutions during the removal of resist patterns, leading to deterioration of spectral characteristics.

Innovation Solution

A method involving the formation of a protective layer on the infrared light cut layer to prevent contact with stripping solutions, followed by patterning using a resist pattern and dry etching, and subsequent removal of the resist pattern with a stripping solution, thereby minimizing dye elution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the resist pattern is removed by applying stripping solution directly to the infrared light cut layer, then the resist pattern removal is effective, but the infrared light absorbing dye elutes and spectral characteristics deteriorate

Engineering Contradiction:

Improveresist pattern removalVSAvoidspectral characteristics

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

A protective layer is introduced as an intermediary between the stripping solution and the infrared light absorbing dye. This protective layer allows the stripping solution to remove the resist pattern while preventing the stripping solution from contacting and eluting the infrared light absorbing dye, thus resolving the contradiction between effective resist removal and maintaining spectral characteristics

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The structure is segmented into multiple layers: the infrared light cut layer containing the infrared light absorbing dye, a protective layer formed on it, and the resist pattern on top. This segmentation allows the stripping solution to act on the resist pattern without directly contacting the infrared light absorbing dye, preventing dye elution while maintaining spectral characteristics

Inventive Principle:

Principle #1Segmentation

2Device complexity

If no protective layer is formed, then the manufacturing process is simpler, but the stripping solution permeates and causes dye elution

Engineering Contradiction:

Improveprocess stepsVSAvoiddye elution

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The protective layer serves as a mediator that blocks the harmful effect of the stripping solution from reaching the infrared light absorbing dye. Although this adds a process step, it effectively prevents dye elution and maintains spectral characteristics, resolving the contradiction between process simplicity and preventing harmful effects

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The protective layer effectively prevents stripping solution permeation, maintaining the spectral characteristics and heat resistance of the infrared light cut filter by reducing dye elution, thus enhancing the reliability of the filter.

Implementation Method 1

An infrared light absorbing dye of the infrared light cut filter absorbs infrared light, thereby cutting infrared light that can be detected by each photoelectric conversion element from entering the photoelectric conversion element

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 2

forming a protective layer on the infrared light cut layer which provides protection against a stripping solution

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 3

patterning the protective layer and the infrared light cut layer by dry etching based on the resist pattern

Methodology Applied

Scientific EffectPlasma etching: Plasma

Data Source

PatentUS12429638B2Method for producing infrared light cut filter, filter for solid-state imaging device, and solid-state imaging device

Publication Date: 2025.09.30 TOPPAN INC

AI summary

A method for producing an infrared light cut filter, including forming an infrared light cut layer comprising an infrared light absorbing dye, forming a protective layer on the infrared light cut layer which provides protection against a stripping solution, forming a resist pattern on the protective layer, patterning the protective layer and the infrared light cut layer by dry etching based on the resist pattern, and removing the resist pattern from the protective layer by applying the stripping solution.