Infrared Imaging Device Thermal Isolation Support Beam

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Solution Overview

Problem

Infrared detection sensitivity in uncooled infrared imaging devices is insufficient due to inadequate thermal isolation of the infrared detecting section from the surroundings, limiting thermoelectric conversion efficiency.

Innovation Solution

The design includes a substrate with a detecting section featuring an infrared absorbing section and a thermoelectric converting section thermally connected to the substrate, supported by a thin support beam with low thermal conductivity, which minimizes thermal conduction and enhances thermal insulation by spacing the detecting section from the substrate, and a method for manufacturing this configuration involving semiconductor and conductive film processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the infrared detecting section is supported close to the substrate, then the device structure is simple, but the thermal insulation is insufficient and detection sensitivity is low

Engineering Contradiction:

Improveinfrared detection sensitivityVSAvoidsupport structure complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The support structure is divided into multiple segments: a support leg extending from the substrate, an intermediate layer wrapped around the support leg, and a detecting section supported above the substrate. This segmentation allows thermal insulation to be integrated into the support structure without excessive complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An intermediate layer is introduced as a mediator between the support leg and the detecting section. This intermediate layer provides thermal insulation while maintaining structural support, resolving the contradiction between simple support structure and sufficient thermal insulation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of energy

If the interconnection layer uses material with high specific resistance, then thermal conductivity is reduced, but electrical connection efficiency deteriorates

Engineering Contradiction:

Improvethermal conduction lossVSAvoidelectrical connection reliability

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The interconnection layer uses different materials in different regions: a first interconnection layer with high specific resistance material for thermal insulation, and a second interconnection layer with low specific resistance material for efficient electrical connection. This local differentiation resolves the contradiction between reducing thermal conduction and maintaining electrical connection reliability.

Inventive Principle:

Principle #3Local quality

3Measurement precision

If the detecting section is thermally isolated from the substrate, then thermoelectric conversion efficiency increases, but the device requires more complex thermal management structure

Engineering Contradiction:

Improvethermoelectric conversion efficiencyVSAvoidthermal management structure complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The thermal management function is merged with the support structure by integrating the intermediate insulating layer into the support leg assembly. This combination provides thermal isolation without requiring separate thermal management components, thus improving thermoelectric conversion efficiency without excessive structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves the thermal insulation of the detecting section, leading to increased infrared detection sensitivity and efficiency in the infrared imaging device.

Implementation Method 1

a thermoelectric converting section provided between the infrared absorbing section and the substrate, spaced from the substrate, thermally connected to the infrared absorbing section, and configured to convert temperature change due to the infrared radiation absorbed in the infrared absorbing section to an electrical signal

Methodology Applied

Scientific EffectThermoelectric conversion: Seebeck Effect

Implementation Method 2

an infrared absorbing section provided above and spaced from the substrate and configured to absorb infrared radiation

Methodology Applied

Scientific EffectInfrared radiation absorption: Absorption (EM radiation)

Implementation Method 3

supported by a thin support beam with low thermal conductivity, which minimizes thermal conduction and enhances thermal insulation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8749010B2Infrared imaging device and method for manufacturing same

Publication Date: 2014.06.10 KK TOSHIBA

AI summary

According to one embodiment, an infrared imaging device includes a substrate, a detecting section, an interconnection, a contact plug and a support beam. The detecting section is provided above the substrate and includes an infrared absorbing section and a thermoelectric converting section. The interconnection is provided on an interconnection region of the substrate and is configured to read the electrical signal. The contact plug is extends from the interconnection toward a connecting layer provided in the interconnection region. The contact plug is electrically connected to the interconnection and the connecting layer. The support beam includes a support beam interconnection and supports the detecting section above the substrate. The support beam interconnection transmits the electrical signal from the thermoelectric converting section to the interconnection.