Infrared Microscope Connection Optical System Alignment
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Solution Overview
Problem
The existing infrared microscope systems require a lengthy and often inaccurate adjustment process to align the optical axis of the infrared light beam from the FTIR with the optical axis of the infrared microscope, leading to inefficiencies and potential misalignment, especially when using red laser light for guidance.
Innovation Solution
The use of a high-sensitivity CMOS camera to detect the infrared light beam directly, allowing for real-time adjustment of the connection optical system and reducing reliance on red laser light for alignment, with the option to employ a white LED visible light source and a Jacquinot stop for improved precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If red laser light is used for alignment guidance, then the alignment process can be performed with visible light, but the alignment time becomes excessively long and precision is reduced
Solution Approach 1:
The patent changes the detection parameter from visible light (red laser) to infrared light detection. By using a CMOS camera that can detect infrared light, the system directly observes the infrared beam position without relying on red laser guidance, fundamentally changing how alignment is performed and reducing alignment time significantly.
Solution Approach 2:
The patent replaces the mechanical adjustment system based on red laser visual guidance with an optical detection system using infrared-sensitive CMOS camera. This substitution allows direct observation of the infrared beam position, eliminating the need for indirect red laser alignment methods.
2Ease of operation
If red laser light is used for alignment guidance, then the alignment process can be performed with visible light, but the alignment precision becomes insufficient
Solution Approach 1:
The patent changes the detection parameter from visible light wavelength to infrared light wavelength. The CMOS camera is configured to detect infrared light, allowing direct observation of the actual infrared beam position rather than using red laser as a proxy, thereby achieving precise alignment with the infrared optical axis.
Solution Approach 2:
The patent creates an optical copy of the infrared beam using the CMOS camera's infrared detection capability. Instead of using a separate red laser beam as an alignment guide, the system captures and displays the actual infrared beam position on the camera sensor, providing an accurate visual representation for alignment purposes.
3Reliability
If the connection optical system is adjusted using traditional methods, then the optical axis alignment can be attempted, but the adjustment process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the complex mechanical adjustment process based on red laser guidance with a simplified optical detection method. The CMOS camera directly detects the infrared beam position, providing immediate visual feedback that guides the adjustment of plane mirrors, thereby simplifying the overall adjustment process while maintaining reliability.
Solution Approach 2:
The patent implements a feedback mechanism where the CMOS camera continuously monitors the infrared beam position and displays it in real-time. This visual feedback allows operators to make precise adjustments to the connection optical system's plane mirrors, directly observing the effect of each adjustment on beam alignment without complex intermediate steps.
4Reliability
If traditional alignment methods are used, then the optical system can be adjusted, but troubleshooting becomes difficult and time-consuming
Solution Approach 1:
The patent implements real-time visual feedback through the CMOS camera that displays the infrared beam position and shape. This continuous monitoring capability allows operators to quickly identify alignment issues, track beam position changes during adjustment, and verify proper alignment, thereby significantly reducing troubleshooting time while maintaining alignment reliability.
Solution Approach 2:
The patent creates a visual copy of the infrared beam using the CMOS camera's detection capability. This optical copy allows operators to observe the beam position, shape, and intensity distribution directly, making it easier to diagnose alignment problems and verify corrections without complex measurement equipment or time-consuming procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required for alignment, enhances precision, and allows for quick troubleshooting by comparing stored infrared light images with current images, minimizing instrument errors and identifying potential misalignments.
Implementation Method 1
a high-sensitivity CMOS camera to detect the infrared light beam directly
Implementation Method 2
a visible light source unit (30) which outputs visible light
Implementation Method 3
a connection optical system which guides infrared light, supplied from an infrared spectrophotometer, to said illumination optical system
Data Source
AI summary
An infrared microscope includes an illumination optical system which guides infrared red to an analysis position on a sample; a connection optical system which guides infrared light, supplied from an infrared spectrophotometer, to said illumination optical system; a visible light source unit which outputs visible light to a region including said analysis position on the sample; an image acquisition unit which inputs visible light from the region including said analysis position on the sample to a detection surface and acquires a visible light image; and a detection unit which detects infrared light from said analysis position on the sample. The connection optical system can be positionally adjusted, and said image acquisition unit is capable of acquiring an infrared light image by inputting infrared light to a detection surface.