Infrared Imaging Pixel Layout for Fast Polarization Detection

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Solution Overview

Problem

Conventional thermal infrared detection devices face challenges in miniaturization, leading to increased signal read time, signal variation, insufficient heat insulation, and reduced sensitivity, while also lacking the ability to detect polarization states of infrared rays effectively.

Innovation Solution

The proposed imaging device incorporates a configuration with temperature detection element units and infrared absorption layers arranged in specific patterns along different directions, where each temperature detection element is thermally connected to its respective infrared absorption layer, and the size and position of these layers vary to optimize heat transfer and minimize signal variation, enabling miniaturization and polarization state detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the thermal infrared detection element is miniaturized to increase the number of elements, then the detection coverage is improved, but the time required to read the signal increases

Engineering Contradiction:
Improvedetection coverageVSAvoidsignal read time
Core Design Contradiction:
Area of stationary objectVSLoss of time

Solution Approach 1:

The detection element is divided into multiple independent temperature detection elements arranged in a two-dimensional matrix, with each element having its own infrared absorption layer and thermally connected structure. This segmentation allows parallel signal reading across multiple elements, reducing the overall read time while maintaining comprehensive detection coverage

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Temperature detection elements are arranged in a two-dimensional matrix configuration rather than a single line or single point, enabling simultaneous detection across multiple spatial dimensions and facilitating parallel signal acquisition that reduces read time

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the thermal infrared detection element is miniaturized to increase the number of elements, then the detection coverage is improved, but variations in read signals increase

Engineering Contradiction:
Improvedetection coverageVSAvoidsignal variation
Core Design Contradiction:
Area of stationary objectVSMeasurement precision

Solution Approach 1:

Each temperature detection element in the array is equipped with its own dedicated infrared absorption layer and thermally connected structure, ensuring that each element maintains optimal local thermal characteristics and signal quality, thereby reducing variations across the array while achieving wide detection coverage

Inventive Principle:
Principle #3Local quality

3Volume of moving object

If the thermal infrared detection element is miniaturized, then the device size is reduced, but the region for thermal insulation decreases and heat insulation from the surroundings becomes insufficient

Engineering Contradiction:
Improvedevice sizeVSAvoidheat insulation
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The infrared absorption layer is positioned above the temperature detection element in a nested configuration, with the absorption layer thermally connected to the detection element through a thermally conductive layer. This nested structure allows the smaller detection element to maintain effective thermal insulation by concentrating the thermal interaction within a compact vertical arrangement rather than requiring extensive lateral insulation regions

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for faster signal read times, improved sensitivity, and reduced variations in temperature detection, while also enabling the detection of polarization states of infrared rays, addressing the limitations of conventional devices.

Implementation Method 1

an infrared absorption layer arranged apart from the first A region and the second A region along an infrared incident direction, and thermally connected to the first temperature detection element

Methodology Applied
Scientific EffectInfrared absorption: Absorption (EM radiation)

Implementation Method 2

the infrared absorption layer is thermally connected to the first temperature detection element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a plurality of temperature detection element units arranged along a first direction and a second direction different from the first direction; and a plurality of infrared absorption layer units arranged along the first direction and the second direction

Methodology Applied
Scientific EffectThermal detection: Thermography

Data Source

PatentEP3805718B1Imaging device
Publication Date: 2024.06.26 SONY SEMICON SOLUTIONS CORP
  • EP3805718B1 patent drawingFigure 1A~1B
  • EP3805718B1 patent drawingFigure 2
  • EP3805718B1 patent drawingFigure 3

AI summary

An imaging device includes a plurality of temperature detection element units and a plurality of infrared absorption layer units arranged along a first direction and a second direction, in which: each of the temperature detection element units includes a first temperature detection element 21 and a second temperature detection element 22 adjacent to each other along the first direction; each of the infrared absorption layer units includes a first infrared absorption layer 41 and a second infrared absorption layer 42 adjacent to each other along the second direction; the first infrared absorption layer 41 is arranged above a first A region 211 and a second A region 221 and is thermally connected to the first temperature detection element 21; and the second infrared absorption layer 42 is arranged above a first B region 212 and a second B region 222 and is thermally connected to the second temperature detection element 22.