Infrared Pixel Structure with Variable Capacitor for Hybrid Imaging
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Solution Overview
Problem
Conventional imaging systems using separate visible and long-wave band imaging chips suffer from image bias and low sensitivity due to inconsistent optical paths, affecting imaging quality, especially in night or high dynamic range environments.
Innovation Solution
An infrared pixel structure integrated on a silicon substrate with a variable capacitor design, utilizing a piezoresistor and infrared-sensitive elements to detect infrared light by generating thermal deformation and changing capacitive signals, enhancing sensitivity and hybrid imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate visible and long-wave band imaging chips are used, then imaging coverage is expanded, but image bias and low sensitivity occur due to inconsistent optical paths
Solution Approach 1:
The patent combines visible light detection and infrared light detection into a single hybrid imaging device with an integrated pixel structure. The pixel structure includes both visible light sensitive elements and infrared sensitive elements sharing common optical paths and signal processing circuits, eliminating the need for separate imaging chips and their associated optical systems. This merging approach maintains consistent optical paths while achieving multi-spectral imaging coverage.
2Adaptability or versatility
If conventional separate imaging systems are used, then different wave bands can be detected, but sensitivity is reduced due to individual optical systems
Solution Approach 1:
The patent integrates visible light detection and infrared detection functions into a unified pixel structure where both detection types share common optical paths and signal processing resources. This shared architecture increases sensitivity by eliminating redundant optical components and improving signal-to-noise ratio, while maintaining the ability to detect multiple wave bands simultaneously.
3Adaptability or versatility
If separate optical systems are used for visible and infrared imaging, then different spectral ranges are covered, but image composition accuracy deteriorates due to optical path inconsistency
Solution Approach 1:
The patent creates a unified optical path structure where visible light and infrared light travel through the same optical channels from the target to the detection elements. This single optical path design ensures that both spectral ranges capture the exact same spatial information, eliminating registration errors and composition inaccuracies that occur when combining images from separate optical systems.
4Reliability
If a variable capacitor structure is implemented, then imaging sensitivity increases, but device complexity increases
Solution Approach 1:
The patent employs a variable capacitor structure where the capacitance value changes in response to detected signal levels. This phase transition in electrical properties allows the device to dynamically adjust its sensitivity, enhancing imaging performance for different signal intensities while using a relatively simple capacitive mechanism rather than complex active control circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The infrared pixel structure improves imaging sensitivity and quality by integrating visible and infrared light detection on a single silicon substrate, reducing image bias and enhancing monitoring performance in various environments.
Implementation Method 1
an infrared-sensitive element provided on an upper surface of the top connector, for absorbing incident infrared light and producing thermal deformation
Implementation Method 2
producing thermal deformation to make the non-fixed end move relative to the fixed end and produce a relative displacement between the top plates and the bottom plates
Implementation Method 3
The top connector is connected to the lead end of the upper electrode through a piezoresistor
Data Source
AI summary
The present invention provides an infrared pixel structure and a hybrid imaging device which use comb-shaped top plates and bottom plates to form capacitors. The upper electrode has a non-fixed end such that the infrared sensitive element in the upper electrode generates thermal stress and deforms when absorbing the infrared light, which changes the capacitance of the capacitors formed by the top plates and the bottom plates to achieve infrared detection and increase the device sensitivity. Furthermore, the infrared pixel structure can be used in an infrared light and visible light hybrid imaging device to achieve visible light imaging and infrared imaging in a same silicon substrate, so as to increase the imaging quality.